Signal Computing Module Airflow Design for Heat Dissipation
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Solution Overview
Problem
Conventional heat exchanger designs for server systems are inadequate in efficiently managing heat dissipation, leading to potential damage from overheating, especially in high-performance systems with closely packed electrical components, and require increased blower power which adds heat and complexity.
Innovation Solution
An electrical signal computing module with a structured main case body and internal board arrangement that facilitates efficient air flow through strategically placed flow holes and heat leading tunnels, allowing external air to effectively exchange heat produced by printed circuit boards, utilizing blowers to draw out air and manage heat distribution across multiple circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the power of the blower is increased to enhance air flow rate for better heat exchange, then the heat exchange efficiency is improved, but the blower produces more heat and adds loading to the server system
Solution Approach 1:
The patent divides the internal space into multiple accommodating areas (first, second, third, and fourth accommodating areas) separated by circuit boards and flow holes. This segmentation allows air to flow through multiple paths and exchange heat with different components in sequence, improving overall heat exchange efficiency without requiring a single high-power blower, thus reducing the heat generated by the blower itself.
Solution Approach 2:
The patent utilizes three-dimensional air flow paths through vertically stacked accommodating areas and horizontal flow holes. Air enters through front flow holes, flows through multiple accommodating areas at different heights, and exits through rear flow holes. This multi-dimensional flow design maximizes heat exchange surface area and efficiency without increasing blower power.
2Volume of stationary object
If the size of the server system is reduced to enhance utilization, then the internal space is optimized, but the air flow path for heat exchange becomes more constrained
Solution Approach 1:
The patent employs a nested structure where circuit boards are arranged vertically to form multiple accommodating areas within each other. Flow holes are created through the circuit boards themselves, allowing air to pass through nested layers. This nesting approach maximizes the use of internal space while maintaining efficient air flow paths for heat exchange, enabling compact server design without compromising cooling performance.
3Quantity of substance
If electrical components are placed closer together to reduce size, then the component density is improved, but the heat generated by multiple components increases and requires more effective heat exchange
Solution Approach 1:
The patent creates different local flow characteristics in different accommodating areas. Each accommodating area has its own flow holes and air flow paths, allowing localized heat exchange optimization. Air flow rate and direction can be optimized for each specific area based on the heat generation characteristics of components in that area, effectively managing heat from high-density component placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat exchange efficiency, prevents overheating, and reduces the overall size and power consumption of the server system while maintaining performance, by optimizing air flow and heat management according to fluid mechanics principles.
Implementation Method 1
The blower disposed inside electrical device is common in conventional skill to change heat. The air produced by blower has efficient heat transfer to cool down the electrical component.
Implementation Method 2
Heat exchanging tube and heat sink disposed on electrical component or in the electrical device are also common used in conventional skill to exchange heat, the exchanging tube can transfer heat, and the heat sink has broad heat exchanging surface, both can cool down the electrical component.
Data Source
AI summary
The present invention is an electrical signal computing module capable of accommodating printed circuit board, able to lead the exterior air into the main case body, exchange heat with the printed circuit boards, without accumulation of heat and damage of the printed circuit board. The present invention has a main case body with a bottom case and an internal board set, and four accommodating areas are formed by the internal board set and a transmission circuit board, in addition, numerous flow holes disposed at specific position are designed for air flowing in, exchanging heat produced by printed circuit boards as well.