Power semiconductor package signal connection component and semiconductor module
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Solution Overview
Problem
Current power semiconductor package signal connection components have insufficient solder thickness due to flat surfaces, leading to poor reliability in electrical connections between laminate substrates and external terminals.
Innovation Solution
A power semiconductor package signal connection component with a continuous protrusion pattern on its bases, featuring a concave-convex design that increases solder thickness and prevents solder from entering the cylinder, enhancing structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat surface is used for the connection component, then the manufacturing is simple, but the solder thickness is insufficient leading to poor reliability
Solution Approach 1:
The connection component base features a protrusion pattern with varying heights (first protrusions with first heights and second protrusions with second heights different from the first), creating localized variations in surface topology. This non-uniform structure increases solder volume and improves electrical connection reliability without requiring complete redesign of the entire connection component
Solution Approach 2:
The invention transitions from a traditional flat two-dimensional surface to a three-dimensional surface with protrusions of varying heights. This dimensional change creates additional volume for solder accommodation, effectively increasing solder thickness and improving connection reliability while maintaining manufacturing feasibility
2Quantity of substance
If a flat surface is used for the connection component, then the structure is simple, but solder easily runs into the cylinder causing insufficient solder volume
Solution Approach 1:
The protrusion pattern creates localized regions of varying heights on the base surface, with first protrusions having first heights and second protrusions having second heights. This local variation in surface topology traps and retains solder in specific regions, preventing solder from running into the cylinder while increasing overall solder volume
Solution Approach 2:
The protrusion structure converts the potential harmful effect of solder running into the cylinder into a beneficial effect by creating controlled retention zones. The varying heights of protrusions act as barriers that guide and hold solder in appropriate positions, transforming a manufacturing defect into a design feature that ensures adequate solder volume
Data Source
AI summary
A power semiconductor package signal connection component includes a cylinder having a first through hole and two bases respectively disposed on opposite sides of the cylinder. Each base includes a continuous protrusion pattern and has a flat surface, a curved surface, and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole runs through the curved surface and communicates with the first through hole. The continuous protrusion pattern is connected to a second side of the curved surface and is located on the flat surface.