High-Speed Signal Frequency Measurement and Integrity Testing
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Solution Overview
Problem
High-speed digital chips with distorted or confused waveform data can lead to functional failures and security risks in electronic systems, necessitating an effective method for identifying and eliminating unqualified chips before integration.
Innovation Solution
A test method for high-speed signal frequency measurement and signal integrity that involves transmitting a 100 M square wave to the digital chip, frequency-dividing the output signal, and comparing it with preset data to determine if the chip meets frequency specifications, while also sampling and comparing output data for signal integrity, thereby accurately identifying qualified or defective chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-speed digital chips are used for data transmission and storage, then the processing speed and functionality are improved, but the risk of waveform distortion and functional failure increases
Solution Approach 1:
The patent implements preliminary testing of digital chips before they are integrated into electronic systems. The test system performs frequency measurement and signal integrity verification in advance, identifying and eliminating defective chips before they cause system failures. This preliminary action prevents the propagation of distorted waveforms through the system.
Solution Approach 2:
The patent employs feedback mechanisms where the test system continuously monitors output signals from digital chips, compares them against expected parameters (frequency range, signal integrity), and provides pass/fail determination. This feedback loop ensures that only chips meeting specifications are approved for use, maintaining signal integrity in high-speed applications.
2Reliability
If frequency measurement and signal integrity testing are performed on digital chips, then the reliability of the electronic system is improved, but the testing time and complexity increase
Solution Approach 1:
The patent segments the testing process into distinct functional modules: signal generation, frequency measurement, signal integrity testing, and result determination. Each module performs a specific function independently, allowing for efficient parallel processing and reducing overall testing time while maintaining comprehensive coverage of quality parameters.
Solution Approach 2:
The patent utilizes parameter changes in the test signal (such as varying frequencies or signal patterns) to efficiently characterize chip performance across multiple operating conditions. By changing test parameters systematically, the system can verify frequency response and signal integrity without requiring separate physical tests for each condition, reducing total testing time.
Data Source
AI summary
The invention discloses a test method for high-speed signal frequency measurement and signal integrity. Through the combination of integrated circuit digital-analog test system and programmable digital system, the trigger signal of the test system is synchronized with the digital signal of the peripheral test circuit to generate 100 M square wave and data to verify whether the chip can work normally. When the enabling signals of the integrated circuit digital-analog test system are detected by the peripheral test circuit, the corresponding square wave signal of 100 M or the preset data signal are given to the tested digital chip. The two enabling signals have the same priority, and then sample the output of the tested digital chip, wherein, the collected output waveform needs to be logically calculated and divided into a 10 M square wave, and the frequency measurement is carried out, then the processed results are returned to the test system. The test system accurately selects the chip with correct function according to the data, and eliminates the chip with abnormal work.