Signal Isolator Coil Shielding for High-Voltage Coupling

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Solution Overview

Problem

Current electronic devices for signal isolation are limited by low operating voltages, low coupling coefficients, and require separate discrete components, making them bulky and inefficient.

Innovation Solution

A signal isolation device comprising a transmit die and a receiver die with integrated coils and shield layers, capable of generating high-voltage signals with high coupling coefficients, while maintaining electrical isolation and compact size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If current electronic devices are used for signal isolation, then electrical isolation is achieved, but the operating voltage is limited and the coupling coefficient is low

Engineering Contradiction:
Improvesignal isolationVSAvoidoperating voltage
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

The patent replaces traditional magnetic coupling mechanisms with electric field-based capacitive coupling. The transmitter and receiver electrodes form a capacitive coupler that directly couples electrical signals through electric fields, eliminating the need for magnetic cores and windings. This substitution enables high-voltage operation (up to 1000V RMS) while maintaining strong coupling coefficients, as the electric field can be directly controlled and optimized through electrode geometry and dielectric material selection.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental operating parameters by using high-voltage capable dielectric materials and optimizing electrode configurations to achieve both high voltage tolerance and high coupling coefficients. The dielectric layer between electrodes is specifically designed to withstand high voltages while the electrode geometry is optimized to maximize electric field coupling, thereby simultaneously improving both operating voltage and coupling efficiency.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If separate discrete components are used for signal isolation, then signal isolation function is achieved, but the device size is large and integration is poor

Engineering Contradiction:
Improvesignal isolation functionVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent merges the signal isolation function with the printed circuit board structure itself. The capacitive coupler is formed by conducting traces and electrodes directly on the PCB layers, eliminating the need for separate isolation components. The dielectric layer is integrated into the PCB laminate, and the transmitter/receiver electrodes are formed as conductive patterns on the board surface, creating a compact integrated solution that provides signal isolation without requiring additional discrete components.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If traditional isolators are used, then signal isolation is achieved, but the coupling coefficient is relatively low

Engineering Contradiction:
Improvesignal isolationVSAvoidcoupling coefficient
Core Design Contradiction:
ReliabilityVSLoss of information

Solution Approach 1:

The patent replaces magnetic coupling with direct electric field coupling through capacitive structures. This substitution allows for much stronger coupling because the electric field can be concentrated and directed between the transmitter and receiver electrodes with minimal loss. The coupling coefficient is enhanced by optimizing the electrode area, spacing, and dielectric properties, enabling efficient signal transfer with high-fidelity reproduction of the input signal at the output.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Volume of moving object

If integrated design is implemented, then device compactness is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvedevice sizeVSAvoidintegration complexity
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent uses standard PCB fabrication processes to create the capacitive coupler, which significantly simplifies manufacturing. The conducting traces, electrodes, and dielectric layers are all formed using conventional PCB techniques such as copper etching, lamination, and screen printing. This approach avoids complex assembly steps and specialized manufacturing equipment, making the integrated design as manufacturable as traditional PCB-based products while achieving compact form factor and high performance.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device achieves high-voltage signal isolation with high coupling coefficients in a compact form factor, suitable for applications requiring safety, level translation, and multiplexing, while filtering out electromagnetic noise.

Implementation Method 1

the transmit coil induces the receiver coil to generate an intermediate signal corresponding to the input signal

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

a shield layer positioned between the receiver circuitry and the receiver coil

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20250253847A1Method of forming and operating a signal isolation device
Publication Date: 2025.08.07 INTEGENSE MICROELECTRONICS INC
  • US20250253847A1 patent drawing
  • US20250253847A1 patent drawing
  • US20250253847A1 patent drawing

AI summary

A method of operating a signal isolation device includes receiving an input signal at an input of a transmit die and in response, generating a corresponding time varying electrical voltage at a transmitter output of the transmit die. The time varying electrical voltage is coupled to a transmit coil disposed within a receiver die. A receive coil is induced to generate an intermediate signal in response to the coupling of the time varying electrical voltage to the transmit coil, wherein the intermediate signal corresponds to the input signal. The intermediate signal is coupled to receiver circuitry disposed within the receiver die. Electromagnetic noise generated by the receive coil is shielded from the receiver circuitry via a shield positioned between the receive coil and the receiver circuitry.