Signal Isolator Interposer with Magnetic Coils
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Solution Overview
Problem
Conventional signal isolators face challenges in achieving high galvanic isolation levels while maintaining efficient data transfer between different voltage domains, often requiring expensive silicon dies and complex wire bonding.
Innovation Solution
The use of an interposer die with thick dielectric material supports magnetic coils and external package interconnects, providing vertical and horizontal isolation through strategically placed signal paths and magnetic field sensing elements, allowing for effective data transfer between dies in different voltage domains without direct electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional signal isolators use split paddle design with separate dies, then galvanic isolation can be achieved, but manufacturing complexity and cost increase due to expensive silicon dies and wire bonding
Solution Approach 1:
The patent merges the isolation barrier function with the substrate itself by forming an insulating layer directly on the substrate surface. This eliminates the need for separate split paddle dies and wire bonding, as the substrate now provides both mechanical support and electrical isolation. The magnetic coils are also integrated into the substrate structure, further simplifying the overall device architecture while maintaining galvanic isolation between different voltage domains.
2Reliability
If thick dielectric material is used in interposer, then high voltage barrier and galvanic isolation are achieved, but interposer size and complexity increase
Solution Approach 1:
The patent extracts the isolation function from a complex interposer structure and implements it directly on the substrate through a deposited insulating layer. Instead of using a separate thick dielectric interposer that would add size and complexity, the isolation barrier is formed in-situ on the substrate surface, reducing the overall device footprint while achieving the required voltage barrier through the inherent properties of the insulating material layer.
3Reliability
If magnetic coils and sensing elements are integrated on separate dies, then signal transfer between voltage domains is enabled, but device assembly and wiring complexity increase
Solution Approach 1:
The patent merges the magnetic coil structure with the substrate by forming coils directly on the insulating layer that is already present on the substrate. The sensing elements are then positioned to interact with these substrate-integrated coils, eliminating the need for separate dies and complex wire bonding assemblies. This integration approach maintains magnetic coupling for signal transfer while dramatically simplifying the device assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable and cost-effective galvanic isolation with high voltage barrier capabilities, reducing the need for expensive silicon dies and eliminating wire bonds, while maintaining efficient data transfer and processing capabilities.
Implementation Method 1
a first coil to generate a magnetic filed in response to current flow
Implementation Method 2
a second coil to generate a magnetic field in response to current flow
Implementation Method 3
a first magnetic field sensing element associated with the first die
Implementation Method 4
a second magnetic field sensing element associated with the second die
Data Source
AI summary
Methods and apparatus for a signal isolator having a dielectric interposer supporting first and second die each having a magnetic field sensing element. A first signal path extends from the first die to the second die and a second signal path extends from the second die to the first die. In embodiments, the first signal path is located in the interposer and includes a first coil to generate a magnetic field and the second signal path is located in the interposer and includes a second coil to generate a magnetic filed. The first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.