Substrate Signal Line Layout for Real-Time Damage Detection
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Solution Overview
Problem
Current electronic devices lack a mechanism for real-time detection of signal line abnormalities, such as scratches, cracks, or chipping, which can only be determined during the lighting test stage after assembly, causing inconvenience to manufacturers and users.
Innovation Solution
An electronic device with a substrate, signal line, detection line, and detection unit, where the detection line is arranged between the signal line and the substrate edge, electrically insulated from the signal line, allowing for real-time detection of abnormalities through a detection unit connected to the detection line.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If no detection mechanism is provided during production, then device complexity is reduced, but manufacturing precision deteriorates due to inability to detect signal line abnormalities
Solution Approach 1:
The detection line is merged with the signal line structure, sharing the same physical space and insulation layer. The detection line is formed alongside the signal line using the same thin film deposition processes, combining detection functionality with the existing signal transmission structure without requiring separate detection infrastructure.
Solution Approach 2:
The detection line is created as a copy of the signal line structure, with identical insulation layers and substrate integration. This copy structure allows the detection system to mirror the signal line's physical characteristics and vulnerability to damage, enabling accurate anomaly detection through voltage comparisons.
2Reliability
If detection line is added adjacent to signal line, then reliability is improved through real-time monitoring, but device complexity increases due to additional components
Solution Approach 1:
The monitoring function is segmented from the main signal transmission path. The detection line is divided into multiple segments corresponding to different signal line sections, with each segment independently monitored by the detection unit. This segmentation allows targeted detection of specific abnormal regions without requiring complete system redundancy.
Solution Approach 2:
The detection line acts as an intermediary element between the signal line and the detection unit. It transfers voltage information from the signal line environment to the detection unit through electrical insulation, mediating the detection process without direct electrical contact with the signal line, thus maintaining signal integrity while enabling monitoring.
3Loss of time
If detection is performed only during lighting test stage, then ease of manufacture is maintained, but loss of time increases due to late detection of abnormalities
Solution Approach 1:
The detection line is prepared and positioned alongside the signal line during the manufacturing process, before the device is completed and shipped. The detection unit can perform preliminary voltage measurements and anomaly detection during assembly or quality control stages, identifying potential issues before the device reaches the user, thus preventing future failures without complicating the core manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables immediate detection of signal line abnormalities, reducing production waste and user inconvenience by identifying issues before the lighting stage, thereby enhancing quality control and reducing costs.
Implementation Method 1
the detection line is electrically insulated from the signal line
Data Source
AI summary
An electronic device includes: a circuit board, a substrate, a first signal line, a second signal line and a first chip. The substrate has a peripheral area, a first side edge having a first extending direction and a second side edge having a second extending direction not parallel to the first extending direction. The first signal line is disposed on the substrate and in the peripheral area. The second signal line is disposed on the substrate and is adjacent to the first signal line. The chip is disposed on the circuit board and is electrically connected to the first signal line. Wherein, the first signal line has a first section disposed between the second signal line and the first side edge and a second section disposed between the second signal line and the second side edge, and the first section of the first signal line extends along the first extending direction and the second section of the first signal line extends along the second extending direction.