Multilayer Circuit Signal Line Transition Element
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Solution Overview
Problem
Current radio communication systems, especially those using millimeter-wave radios, face challenges in integrating high-gain antennas with RF front-end circuits due to expensive and bulky components, limiting their integration and increasing the difficulty of steering the narrow beamwidth of high-gain antennas.
Innovation Solution
A circuit device with a signal line transition element that passes high-frequency signals through multiple layers of a multilayer circuit carrier, utilizing impedance transformers for impedance matching between signal transmission lines and the signal line transition element, allowing for a low-cost, integrated antenna or antenna array design that is compatible with PCB or LTCC manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If waveguides and package-level microstrip structures are used to interconnect semiconductor elements and antennas, then signal transmission is achieved, but the system becomes expensive and bulky
Solution Approach 1:
The patent transitions from planar microstrip structures to three-dimensional multilayer signal transmission paths. Signal transmission lines are routed through multiple layers of the package substrate, utilizing vertical and lateral dimensions to achieve signal interconnection between semiconductor elements and antennas without requiring bulky waveguide structures.
Solution Approach 2:
The patent integrates the signal transmission function directly into the package substrate structure. The multilayer substrate serves dual purposes: as the mechanical package housing and as the signal transmission medium, eliminating the need for separate waveguide components and reducing overall system complexity.
2Speed
If high-gain antennas are used to extend operating distance, then signal range is improved, but beam width becomes very narrow making pointing difficult
Solution Approach 1:
The patent divides a single high-gain antenna into multiple smaller antenna elements arranged in an array configuration. Each element can be independently controlled with different phase and amplitude settings, allowing the combined radiation pattern to be electronically steered without physically moving the entire antenna structure.
Solution Approach 2:
The patent implements dynamic beam steering capability through electronic phase control of multiple antenna elements. The beam direction can be changed in real-time by adjusting the phase shifters associated with each element, providing operational flexibility without mechanical movement.
3Adaptability or versatility
If RF die with integrated antenna or antenna array is packaged, then integration is achieved, but packaging becomes extremely difficult and very expensive
Solution Approach 1:
The patent designs the multilayer substrate to serve multiple functions: as the package housing, as the signal transmission medium, as the mounting platform for semiconductor elements, and as the integration structure for antenna elements. This universal design simplifies manufacturing by reducing the number of separate components and assembly steps.
Solution Approach 2:
The patent enables the substrate structure to automatically provide signal transmission paths and mechanical support without requiring additional complex packaging components. The integrated design allows standard PCB manufacturing techniques to be used, making the packaging process more straightforward and cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a low-cost, integrated antenna or antenna array with minimal impact on antenna performance, improving signal transmission by reducing signal loss and allowing for flexible signal routing and electromagnetic shielding, thus addressing the integration and cost issues of high-gain antennas in radio communication systems.
Implementation Method 1
The first impedance transformer is disposed on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal, for providing impedance matching between the first signal transmission line and the signal line transition element
Data Source
AI summary
A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.