Signal Path Swapping Circuit for Pad-Limited Impedance Calibration
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Solution Overview
Problem
Existing semiconductor apparatuses face challenges in simultaneous calibration of termination resistance due to the need for multiple control signals and the impossibility of bonding certain pads without crossing coupling lines, which affects efficient impedance matching and signal transmission.
Innovation Solution
The semiconductor circuit and apparatus employ a swapping circuit that couples internal circuits to pads based on master information and swapping information, enabling efficient signal path swapping between semiconductor chips, thus allowing for simultaneous calibration of termination resistance with a reduced number of pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple control signals are used for calibration, then calibration precision is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple control signals into a single control signal that can simultaneously control the calibration of multiple semiconductor chips. The swapping circuit responds to one control signal by coordinating the calibration operations of multiple chips, thereby reducing control signal complexity while maintaining calibration precision through the unified control mechanism.
Solution Approach 2:
The swapping circuit is designed with multi-functionality to perform different calibration operations based on a single control signal. It can selectively connect different pads to the calibration circuit depending on the calibration mode required, making the control signal universal for multiple calibration scenarios and reducing the need for multiple specialized control signals.
2Reliability
If multiple pads are used for bonding, then signal transmission reliability is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent employs a dynamic swapping circuit that can reconfigure pad connections based on calibration requirements. During calibration mode, the swapping circuit dynamically connects specific pads to the calibration circuit, while during normal operation, it restores original signal paths. This dynamic reconfiguration allows reliable signal transmission through selective pad usage without requiring permanent complex bonding structures.
Solution Approach 2:
The swapping circuit is pre-configured with multiple possible connection paths between pads and the calibration circuit. Before calibration begins, the circuit is set up with the appropriate connections based on the chip arrangement and calibration requirements. This preliminary configuration simplifies the bonding process by predetermined connection routes while ensuring reliable signal transmission during calibration operations.
3Manufacturing precision
If pads are bonded without crossing coupling lines, then manufacturing precision is improved, but adaptability decreases
Solution Approach 1:
The swapping circuit acts as an intermediary between the pads and the calibration circuit. It provides multiple intermediate connection paths that allow the calibration circuit to access different pads without requiring direct bonding that would create crossing coupling lines. This intermediary structure maintains manufacturing precision by avoiding complex crossed bonds while preserving adaptability through the swapping circuit's ability to route signals through different intermediate paths.
Solution Approach 2:
The patent introduces an additional dimensional layer of routing through the swapping circuit architecture. Instead of direct pad-to-calibration-circuit bonds that may require crossing lines, the swapping circuit adds an intermediate routing dimension with multiple available paths. This dimensional change allows calibration adaptability while maintaining simple, non-crossing bond layouts for manufacturing precision.
Data Source
AI summary
A semiconductor circuit includes a first pad, a second pad, swapping circuit, and an internal circuit. The internal circuit receives a first external signal and a second external signal, and generates a first internal signal and a second internal signal. Based on master information and swapping information, the swapping circuit couples the internal circuit to one of first and second pads to provide a path through which the first internal signal is output and a path through which the first external signal is received, and couples the internal circuit to the other of the first and second pads to provide a path through which the second internal signal is output and a path through which the second external signal is received.