Signal Processing Device Thermal Management via Intermediary Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The signal generation circuit in existing solid-state imaging devices generates heat due to power consumption, which can affect the quality of the output signal.
Innovation Solution
A signal processing device is designed with a first substrate that includes a signal generation circuit for generating a reference signal, a circuit element different from the signal generation circuit, and a contact region where a contact connects the substrate and a wiring layer. The contact region is arranged between the signal generation circuit and the circuit element to improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the signal generation circuit is placed close to the circuit element for efficient signal delivery, then the signal transmission quality is improved, but the heat generated by the signal generation circuit adversely affects the circuit element
Solution Approach 1:
A contact region is introduced as an intermediary structure between the signal generation circuit and the circuit element. This contact region serves as a thermal pathway that allows heat to be dissipated from the signal generation circuit to the circuit element through a controlled interface, while still maintaining electrical connection and signal transmission functionality. The contact region acts as a mediator that manages both thermal and electrical interactions between the two components.
2Reliability
If the signal generation circuit operates at high power to ensure signal stability, then the signal quality is improved, but the heat generation increases and affects nearby circuit elements
Solution Approach 1:
The invention changes the thermal management parameters by introducing a contact region with specific thermal conductivity properties. This contact region modifies the heat dissipation pathway, allowing the signal generation circuit to operate at higher powers for signal stability while controlling the temperature rise through optimized thermal contact. The parameter change enables better thermal management without compromising signal stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation reduces the temperature rise of circuit elements near the signal generation circuit, thereby enhancing the quality of the output signal by minimizing the adverse effects of heat-generated noise.
Implementation Method 1
a contact region in which a contact connecting the first substrate and a wiring layer arranged over the first substrate is arranged. In a plan view with respect to the first substrate, the contact region is arranged between the signal generation circuit and the circuit element.
Data Source
AI summary
Provided is a signal processing device including a first substrate, a signal generation circuit arranged in the first substrate and configured to generate a reference signal to be used for comparison with a signal output from a pixel, a circuit element arranged in the first substrate and different from the signal generation circuit, and a contact region in which a contact connecting the first substrate and a wiring layer arranged over the first substrate is arranged. In a plan view with respect to the first substrate, the contact region is arranged between the signal generation circuit and the circuit element.