Signal Terminal Routing in Semiconductor Encapsulants
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Solution Overview
Problem
In semiconductor devices, a small distance between signal terminals leads to longer bonding wires, increasing impedance and the risk of electrical short circuits due to design constraints within the encapsulant, which complicates signal transmission and increases equipment size.
Innovation Solution
The semiconductor device configuration includes signal terminals that extend farther away from each other inside the encapsulant, allowing them to be closer to the respective semiconductor chips, thereby shortening or omitting bonding wires and enhancing insulation properties, while maintaining a small distance between terminals outside the encapsulant to avoid equipment size increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the distance between signal terminals outside the encapsulant is reduced to avoid increasing external equipment size, then the equipment size is minimized, but the bonding wires become longer causing higher impedance and greater signal transmission loss
Solution Approach 1:
The signal terminals are configured to extend in different directions inside the encapsulant. Specifically, the first signal terminal extends farther away from the second signal terminal along a direction toward the first semiconductor chip, while the second signal terminal extends farther away from the first signal terminal along a direction toward the second semiconductor chip. This spatial arrangement in multiple dimensions allows the terminals to be close outside the encapsulant (minimizing equipment size) while maintaining adequate distance inside the encapsulant (shortening bonding wires and reducing signal loss).
2Area of stationary object
If the distance between signal terminals outside the encapsulant is reduced to avoid increasing external equipment size, then the equipment size is minimized, but the risk of electrical short circuit increases due to longer bonding wires being more likely to be displaced
Solution Approach 1:
By configuring the signal terminals to extend in different directions inside the encapsulant toward their respective semiconductor chips, the invention creates sufficient spatial separation between the terminals within the encapsulant. This dimensional arrangement shortens the bonding wires, making them less prone to displacement during encapsulant formation, thereby reducing the risk of electrical short circuits while maintaining compact external equipment size.
3Length of moving object
If the signal terminals are positioned closer to the semiconductor chips inside the encapsulant, then the bonding wires can be shortened, but the distance between signal terminals outside the encapsulant increases requiring larger external equipment
Solution Approach 1:
The invention resolves this contradiction by utilizing different spatial dimensions. Inside the encapsulant, the signal terminals extend toward their respective semiconductor chips, shortening the bonding wires. Outside the encapsulant, the terminals are positioned close together by extending in different directions, minimizing external equipment size. This multi-dimensional configuration satisfies both requirements simultaneously.
Data Source
AI summary
A semiconductor device may include a first semiconductor chip, a second semiconductor chip, an encapsulant encapsulating the first and second semiconductor chips, a first signal terminal extending over inside and outside of the encapsulant and connected to the first semiconductor chip inside the encapsulant, and a second signal terminal extending over the inside and the outside of the encapsulant and connected to the second semiconductor chip inside the encapsulant. The first and second signal terminals may protrude from the encapsulant in a same direction. The first signal terminal may include, inside the encapsulant, a section where the first signal terminal extends farther away from the second signal terminal along a direction toward the first semiconductor chip. The second signal terminal may include, inside the encapsulant, a section where the second signal terminal extends farther away from the first signal terminal along a direction toward the second semiconductor chip.