Silane Water Scavenger Adhesive for OLED Encapsulation
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Solution Overview
Problem
Existing barrier adhesives for encapsulating (opto-)electronic devices face challenges in providing sufficient protection against water vapor and oxygen permeation, especially in organic electronics, where high reactivity of getter materials can damage sensitive components, and traditional materials compromise transparency and effectiveness.
Innovation Solution
A barrier adhesive comprising a reactive resin with chemically similar activatable groups, such as cyclic ether or acrylate groups, combined with alkoxysilanes as getter materials, which reduce moisture permeation without damaging organic electronics and maintain transparency, featuring a high breakthrough time and suitable for full-surface encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional barrier adhesives are used to protect against water vapor and oxygen permeation, then protection effectiveness is improved, but high reactivity of getter materials damages sensitive organic electronic components
Solution Approach 1:
The patent changes the chemical reactivity parameter of the silane-based water scavenger by selecting specific silane compounds with controlled hydrolysis and condensation rates. This allows the material to effectively scavenge water vapor while maintaining low enough reactivity to avoid damaging sensitive organic electronic components during the encapsulation process.
Solution Approach 2:
The silane-based water scavenger acts as an intermediary substance that provides water vapor barrier protection without directly contacting and damaging the organic electronics. The scavenger is incorporated into the adhesive matrix, allowing it to function as a protective mediator between the external environment and the sensitive electronic components.
2Duration of action of moving object
If highly reactive silane-based water scavengers are used to reduce moisture permeation, then breakthrough time is improved, but transparency and integrity of organic electronics are compromised
Solution Approach 1:
The patent optimizes the molecular structure and concentration of silane compounds to achieve extended breakthrough time (over 1100 hours at 60°C/90% RH) while controlling the reactivity parameters to prevent damage to organic electronics during application and curing processes.
3Ease of manufacture
If conventional adhesive materials are used for encapsulation, then ease of manufacture is improved, but water vapor permeation rate increases
Solution Approach 1:
The patent creates a composite adhesive system combining silane-based water scavengers with conventional adhesive resins and elastomers. This composite formulation maintains the ease of application and processing of traditional adhesives while incorporating water vapor barrier functionality through the silane compounds that react to form protective networks within the adhesive matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves a breakthrough time of over 1100 hours at 60°C/90% RH and 220 hours at 85°C/85% RH while ensuring the integrity and transparency of organic electronics, providing effective protection against water vapor and oxygen without causing damage.
Implementation Method 1
at least one silane-based water scavenger, in particular a silane with at least one alkoxy group and at least one activatable group
Implementation Method 2
the adhesive base has a water vapor permeation rate after activation of less than 100 g/m2
Implementation Method 3
a reactive resin having at least one activatable group, in particular a group which is polymerizable, and at least one silane-based water scavenger, in particular a silane with at least one alkoxy group and at least one activatable group
Data Source
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AI summary
The invention relates to a barrier adhesive mass for encapsulating an (opto)electronic assembly, containing: a glue base, which consists of at least one reactive resin having at least one group that can be activated, at least one polymer, in particular an elastomer, and optionally at least one adhesive resin, the glue base having a water vapor permeation rate after the activation of the reactive resin of less than 100 g/m²d, preferably of less than 50 g/m²d, in particular of less than 15 g/m²d; a transparent molecularly dispersed getter material; and optionally a solvent; characterized in that the getter material is at least one silane, which has at least one alkoxy group and at least one group that can be activated.