Silane Oligomer Barrier Composition for Moisture Expansion Resistance
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Solution Overview
Problem
Conventional barrier film laminates are limited in application due to their film form and can be damaged by moisture expansion in high temperature environments, restricting their use in sealing electronic components.
Innovation Solution
A barrier material formation composition comprising a silane oligomer modified with a metal alkoxide, which is applied and heated to form a flexible, moisture-resistant barrier material capable of suppressing fracture due to internal moisture expansion, suitable for various object shapes and high temperature environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a barrier film laminate is used to seal electronic components, then moisture resistance is improved, but applicability to various shapes is restricted due to film form
Solution Approach 1:
The invention changes the physical state and form of the barrier material from a pre-formed film to a curable composition that can be applied in liquid or paste form and then cured in place. This allows the material to adapt to various shapes and forms while maintaining moisture barrier properties, resolving the contradiction between moisture resistance and shape adaptability
Solution Approach 2:
The invention uses a curable composition as an intermediary form that can be applied to various shapes and then transformed into a solid barrier layer. This intermediary liquid/paste state enables easy application to complex geometries, while the cured state provides the required moisture resistance
2Reliability
If a barrier film laminate is used to seal electronic components, then moisture resistance is improved, but fracture resistance under high temperature is insufficient due to rigidity
Solution Approach 1:
The invention changes the mechanical properties of the barrier material by using a curable composition that transitions from a flexible liquid/paste state during application to a cured solid state that provides both moisture resistance and fracture toughness. The cured material maintains flexibility to accommodate thermal expansion without fracturing
Solution Approach 2:
The curable composition likely forms a composite structure upon curing that combines the moisture barrier properties of inorganic components with the flexibility and fracture resistance of organic polymer matrices, achieving both moisture resistance and damage tolerance under thermal stress
3Reliability
If solder is used to fill void spaces in electronic components, then sealing is achieved, but the component may be destroyed when moisture expands by heating
Solution Approach 1:
The invention changes the material properties from rigid solder to a curable composition that forms a flexible, compliant barrier layer upon curing. This material can accommodate the expansion forces generated by moisture without fracturing or damaging the component, while still providing effective sealing
Solution Approach 2:
The curable composition acts as a cushioning material that is applied beforehand to void spaces and interfaces. When moisture enters and expands during heating, this pre-applied material absorbs and distributes the expansion forces, preventing damage to the component structure while maintaining the seal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a flexible, moisture-resistant barrier material that effectively suppresses fracture and reduces internal moisture, ensuring durability and reliability in high temperature environments, suitable for electronic components and other applications.
Implementation Method 1
a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide
Implementation Method 2
By applying such a composition to an object and heating it, a barrier material excellent in moisture resistance can be easily formed on the object
Implementation Method 3
the barrier material to be formed has flexibility and dehumidifying property, so that fracture of the object can be sufficiently suppressed even when the moisture which has entered the internal part of the object expands by heating
Data Source
AI summary
The present invention provides a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.