Silane-Coated Chuck Interface for Edge Ring Thermal Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing chuck systems in plasma processing chambers suffer from insufficient heat transfer between the edge ring and the rest of the chuck system, leading to nonuniformities in substrate processing, particularly with higher aspect ratio features, and require time-consuming chamber conditioning.
Innovation Solution
A base plate with a substrate support region and surrounding shoulder, coated with a protective coating and a layer of silane coupling agent, followed by a silicone gel layer with specific fillers, enhances thermal and electrical coupling between the edge ring and the base plate, improving thermal transfer and reducing chamber conditioning time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective coating is applied to the base plate, then the base plate is protected from plasma damage, but the thermal coupling between the edge ring and base plate is reduced
Solution Approach 1:
A silane coupling agent layer is introduced as an intermediary between the protective coating and the base plate. This coupling agent contains functional groups that chemically bond to both the protective coating material and the base plate substrate, creating a strong thermal and mechanical bridge that compensates for the thermal isolation effect of the protective coating.
Solution Approach 2:
The base plate structure is transformed into a multi-layer composite material system consisting of the base plate substrate, protective coating layer, and silane coupling agent interface layer. This composite structure combines the plasma resistance of the protective coating with the thermal conductivity of the base plate through the coupling agent's dual-bonding capability.
2Manufacturing precision
If the edge ring is isolated from the base plate, then plasma process control is improved, but heat transfer between the edge ring and base plate is insufficient causing nonuniformities
Solution Approach 1:
The coupling mechanism is applied locally at the interface region between the edge ring and base plate, where thermal contact is critical. The silane coupling agent creates a localized high-performance thermal interface layer that enhances heat transfer precisely where needed, without affecting the overall plasma process control provided by the edge ring isolation.
3Manufacturing precision
If chamber conditioning is performed to improve thermal coupling, then process uniformity is improved, but production time is lost
Solution Approach 1:
The silane coupling agent layer is applied in advance during base plate manufacturing, creating a permanent thermal enhancement structure before the base plate enters service. This preliminary action eliminates the need for time-consuming chamber conditioning procedures, as the thermal coupling is permanently optimized from the start.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal and electrical coupling, ensuring uniform substrate processing and reducing chamber conditioning time, thereby increasing output and lowering ownership costs.
Implementation Method 1
A layer of a silane coupling agent is on the protective coating
Data Source
AI summary
A chuck system for supporting a substrate in a plasma processing chamber is provided. A base plate comprises a substrate support region and a shoulder surrounding the substrate support region. A protective coating is on a surface of the base plate, wherein the protective coating covers at least part of the shoulder. A layer of a silane coupling agent is on the protective coating.