Silane Compositions for PCB Laminates with Colloidal Silica
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing silane compositions used in multi-layer laminates, such as printed circuit boards, are affected by moisture, leading to premature bond failure, and contain toxic disilyl cross-linking agents, necessitating the development of non-toxic alternatives with improved adhesion and stability.
Innovation Solution
The use of novel silane compositions comprising specific coupling agents and colloidal silica, which act as both coupling and cross-linking agents, providing enhanced adhesion and stability while avoiding toxic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If disilyl cross-linking agents are used to improve adhesion and moisture resistance, then bonding strength and stability are improved, but toxicity increases
Solution Approach 1:
The patent removes the toxic disilyl cross-linking agent component from the silane composition while retaining the essential cross-linking function through alternative means, thereby extracting the harmful element while preserving the beneficial bonding stability
Solution Approach 2:
The patent employs colloidal silica as a replacement cross-linking agent that forms stable, non-toxic bonds, effectively using a safer alternative material that achieves the same functional purpose without the toxic properties of disilyl agents
2Strength
If traditional silane coupling agents are used to achieve adhesion, then bonding is formed, but moisture resistance deteriorates leading to premature failure
Solution Approach 1:
The patent creates a composite silane composition combining silane coupling agents with colloidal silica cross-linking agents, where the colloidal silica forms a moisture-resistant network that protects the silane bonds from hydrolysis while maintaining adhesion properties
Solution Approach 2:
The colloidal silica forms a protective cross-linked network in advance that cushions and protects the silane coupling bonds from moisture attack before degradation can occur, preventing premature bond failure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silane compositions exhibit excellent adhesion properties, improved moisture resistance, and long-term stability, reducing the risk of premature bond failure and eliminating the use of toxic cross-linking agents.
Implementation Method 1
cross-linking agents have been combined with the silane coupling agents
Implementation Method 2
increase the adhesive characteristics of many bonds
Implementation Method 3
silane coupling agents can increase the adhesive characteristics of many bonds
Implementation Method 4
exhibit improved moisture resistance
Data Source
AI summary
The invention provides silane compositions which are useful as adhesives, in particular in the preparation of multi-layer laminates such as printed circuit boards. The silane compositions comprise at least one coupling agent selected from the group consisting of (A-1) a silane coupling agent of the formula A(4-x)SiBx (wherein A is a hydrolyzable group, x is 1 to 3, and B is as defined in the description); (A-2) a silane coupling agent of the formula X-{B-[R-Si(A)3]z}x (wherein X is a linear or branched hydrocarbon chain containing from 5 to 10 carbon atoms, B is a divalent or trivalent hetero atom, A is a hydrolyzable group and R, z and x are as defined in the description); (A-3) a tetraorgano silane coupling agent of the formula Si(OR)4 (wherein R is hydrogen, alkyl, aryl, aralkyl, allyl or alkenyl); and (A-4) a water soluble silicate coupling agent characterized by the formula SiO2 • x M2O (wherein x is 1 to 4, and M is an alkali metal or ammonium ion); and (B) a colloidal silica; with the proviso that (a) said colloidal silica (B) is optional if at least one of compounds (A-3) or (A-4) is present; and (b) said colloidal silica (B) is mandatory if none of compounds (A-3) or (A-4) is present. The invention further provides the use of such silane compositions for the production of multilayer circuit boards and the multilayer circuit boards thus obtained.