Silane-Modified Copper Nanoparticles for Smooth Electrode Films
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Solution Overview
Problem
Existing composite copper nanoparticles face challenges with dispersibility in organic solvents and the formation of smooth electrode films, due to aggregation and oxidation issues, which affect adhesion and conductivity.
Innovation Solution
The surfaces of copper nanoparticles are modified with a silane coupling agent, forming a coating film with copper oxide, and the mass carbon concentration from the silane coupling agent is optimized between 0.1 to 1.2% by mass, along with adjusting the number of surface groups to 1.0 to 13.0 per nm², to enhance dispersibility and prevent aggregation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper nanoparticles are used for bonding electronic components or forming wiring, then conductivity and bonding capability are improved, but aggregation occurs due to small particle size and ease of oxidation, reducing dispersibility
Solution Approach 1:
A silane coupling agent is introduced as an intermediary substance between copper nanoparticles and organic solvents. The silane coupling agent modifies the nanoparticle surface with hydrophobic groups, enabling compatibility with organic solvents while maintaining nanoparticle conductivity. This mediator resolves the contradiction by providing both dispersibility in organic media and preserving electrical properties.
Solution Approach 2:
The surface chemistry parameters of copper nanoparticles are changed through silane coupling treatment. By controlling the mass carbon concentration from the silane coupling agent (0.1 to 1.2% by mass) and the number of surface groups (1.0 to 13.0 per nm²), the nanoparticles achieve stable dispersion in organic solvents while maintaining their conductive properties for reliable electronic bonding.
2Stability of the object's composition
If silane coupling treatment is applied to improve dispersibility, then dispersibility in organic solvents is improved, but carbon residues remain when electrode film is formed, impairing adhesion and conductivity
Solution Approach 1:
The mass carbon concentration from the silane coupling agent is precisely controlled within the range of 0.1 to 1.2% by mass, with a preferred range of 0.2 to 0.5% by mass. This parameter optimization ensures sufficient surface modification for dispersibility while limiting carbon residue that would otherwise impair electrode film adhesion and conductivity.
Solution Approach 2:
The invention creates a composite structure where copper nanoparticles are surface-modified with silane coupling agents forming a coating film containing copper oxide. This composite approach combines the conductive properties of copper with the dispersibility benefits of silane modification, while controlling the composition to minimize harmful carbon residues in the final electrode film.
3Reliability
If high concentration of metal is used in conductive pastes, then conductivity is improved, but agglomeration is more likely to occur, reducing uniformity
Solution Approach 1:
The silane coupling agent acts as a steric barrier and intermediary layer between copper nanoparticles in high-concentration conductive pastes. This surface modification prevents direct metal-to-metal contact that would cause agglomeration, allowing high metal concentrations to be maintained while preserving uniform distribution and preventing aggregation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in composite copper nanoparticles with high dispersibility in organic solvents, enabling the formation of smooth electrode films with improved adhesion and conductivity.
Implementation Method 1
the surfaces of copper nanoparticles are modified with a silane coupling agent
Implementation Method 2
modifying the surface of the copper nanoparticles with a silane coupling agent
Implementation Method 3
the copper nanoparticles have a coating film containing copper oxide on at least a part of the surface
Data Source
Figure 1~2
AI summary
One object of the present application is to provide composite copper nanoparticles that have high dispersibility in organic solvents and can be used to form a smooth electrode film. The present invention provides composite copper nanoparticles in which the surfaces of copper nanoparticles are modified with a silane coupling agent, wherein the copper nanoparticles have a coating film containing copper oxide on at least a part of the surface, and wherein the mass carbon concentration derived from the silane coupling agent in the composite copper nanoparticles is 0.1 to 1.2% by mass with respect to the total mass of the composite copper nanoparticles or wherein the number of surface groups derived from the silane coupling agent on the surface of the composite copper nanoparticles is 1.0 to 13.0 per 1 nm2 of the surface area of the composite copper nanoparticles