Silane Coupling Agent for Wire Grid Pattern Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the nano-imprint lithography process for manufacturing wire grid patterns, there is a challenge in preventing the stripping of resin patterns during stamp removal and efficiently removing defective resin patterns, which affects pattern precision and processibility, especially as pattern size increases.
Innovation Solution
A method involving a laminate structure with a base member, a metal layer, a mask layer containing metal oxide, an adhesive layer with a silane coupling agent, and a patterned resin layer, where the laminate is treated with light and acid to form and remove the resin pattern effectively, using silane coupling agents represented by specific chemical formulas to enhance bonding and facilitate rework processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional nano-imprint lithography process is used to form wire grid patterns, then the process can manufacture large-size patterns cost-effectively, but the resin pattern is stripped together with the stamp during removal, causing incomplete pattern formation
Solution Approach 1:
The patent introduces a release layer as an intermediary between the stamp and the resin layer. This release layer prevents direct adhesion between the stamp and resin pattern, allowing the stamp to be removed without stripping the resin pattern. The release layer acts as a mediator that enables clean separation while maintaining pattern integrity.
Solution Approach 2:
The patent modifies the surface energy parameters of the stamp and release layer by applying specific coatings. By controlling the surface energy characteristics, the adhesive force between the stamp and release layer is optimized to be stronger than the force between the release layer and resin pattern, preventing resin stripping during stamp removal.
2Manufacturing precision
If the pattern size precision is increased, then the wire grid pattern achieves higher precision, but the resin pattern stripping problem becomes more serious during stamp removal
Solution Approach 1:
The release layer serves as a protective intermediary that is particularly crucial for high-precision patterns. It prevents mechanical stress and adhesion forces during stamp removal from directly affecting the delicate, high-precision resin pattern, thereby maintaining both pattern integrity and precision.
Solution Approach 2:
The release layer provides beforehand cushioning by being pre-applied to the stamp surface. This cushioning layer absorbs and distributes the mechanical stresses during stamp removal, preventing direct transmission of damaging forces to the high-precision resin pattern.
3Ease of repair
If a rework process is performed to remove defective resin patterns, then additional processing capability is provided, but the defective resin pattern cannot be completely removed and foreign matter remains
Solution Approach 1:
The release layer acts as a removable intermediary that facilitates complete resin pattern removal during rework. By controlling the adhesion characteristics of the release layer, the resin pattern can be completely detached from the substrate without leaving foreign matter, enabling clean rework operations.
4Manufacturing precision
If the resin layer is strongly bonded to the stamp during imprinting, then the pattern transfer is improved, but the resin pattern is stripped during stamp removal
Solution Approach 1:
The release layer is positioned between the stamp and resin layer, creating a controlled adhesion interface. The release layer maintains sufficient adhesion to the resin for pattern transfer while providing a release mechanism that prevents permanent bonding, allowing stamp removal without resin stripping.
Solution Approach 2:
The patent controls the adhesion parameters by selecting materials with appropriate surface energy characteristics. The release layer is designed to have intermediate adhesion strength - strong enough to transfer the pattern but weak enough to allow clean separation during stamp removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents resin pattern stripping during stamp removal and enables easy removal of defective patterns, improving the precision and efficiency of wire grid pattern manufacturing by maintaining strong bonds between layers and allowing for effective rework without additional metal or mask layers.
Implementation Method 1
The silane coupling agent may include a compound represented by Chemical Formula 1-1, Chemical Formula 2-1, or Chemical Formula 3-1
Implementation Method 2
the resin layer may include a photoinitiator and a (meth)acrylate-based monomer or oligomer
Implementation Method 3
the adhesive layer may be irradiated with ultraviolet light to denature the silane coupling agent, thereby making it easy to remove the resin pattern
Data Source
AI summary
A method of manufacturing a wire grid pattern includes providing a laminate having a base member, a metal layer disposed on the base member, a mask layer disposed on the metal layer and containing a metal oxide, an adhesive layer disposed on the mask layer, and a patterned resin layer disposed on the adhesive layer and formed by irradiation of first light; and irradiating the laminate with second light. The adhesive layer may comprise a silane coupling agent.