Silane Coupling Agent Surface Treatment for Semiconductor Package Adhesion

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Solution Overview

Problem

The existing methods for manufacturing semiconductor packages face challenges with low adhesion between the die pad and the sealing resin, leading to potential peeling and cracks due to thermal expansion differences, which can affect electrical resistance and heat dissipation, and insufficient adhesion between the sealing resin and the semiconductor element.

Innovation Solution

A method involving a surface treatment with a silane coupling agent on the die pad, semiconductor element, and connecting members after mounting and connection, creating regions with different bonding strengths to manage thermal stress and improve adhesion between the die pad, semiconductor element, and sealing resin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a roughening process is performed on the die pad to increase adhesion, then the adhesion between die pad and sealing resin is improved, but the manufacturing process complexity increases

Engineering Contradiction:

Improveadhesion between die pad and sealing resinVSAvoidmanufacturing process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The invention changes the chemical parameter of the die pad surface by applying a silane coupling agent, transforming the surface chemistry to enhance adhesion. This chemical modification approach replaces mechanical roughening processes, achieving strong bonding between the inorganic die pad and organic sealing resin without adding complex manufacturing steps

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The silane coupling agent acts as an intermediary substance between the inorganic die pad and organic sealing resin. It forms a chemical bridge that facilitates strong adhesion between these incompatible materials, resolving the fundamental incompatibility issue without requiring complex surface treatment processes

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the sealing resin is peeled off due to thermal expansion differences, then the die pad and sealing resin can accommodate thermal stress, but cracks may occur to the bonding member

Engineering Contradiction:

Improveresistance to thermal stressVSAvoidintegrity of bonding member

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The silane coupling agent is applied beforehand to the die pad surface, creating a protective intermediate layer that cushions the thermal stress between components with different thermal expansion coefficients. This prevents direct stress transmission to the bonding member, avoiding cracks while accommodating thermal expansion differences

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If the adhesion between sealing resin and semiconductor element is increased, then the thermal stress resistance is improved, but the electrical characteristics may be affected

Engineering Contradiction:

Improvethermal stress resistanceVSAvoidelectrical characteristics

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The silane coupling agent creates different adhesion characteristics in different regions: strong adhesion on the die pad surface and controlled adhesion on the semiconductor element surface. This localized differentiation allows strong thermal stress resistance where needed while maintaining electrical characteristics where required

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the bonding strength between the die pad and sealing resin, and between the semiconductor element and sealing resin, reducing the likelihood of cracks and improving electrical characteristics by distributing thermal stress effectively.

Implementation Method 1

a silane coupling agent is applied onto a surface of the heat dissipation substrate, thereby improving the adhesion between the resin substrate and the heat dissipation substrate

Methodology Applied

Scientific EffectChemical bonding: Chemical Bonding

Implementation Method 2

a silane coupling agent is applied onto a surface of the heat dissipation substrate, thereby improving the adhesion between the resin substrate and the heat dissipation substrate

Methodology Applied

Scientific EffectChemical bonding: Chemical Bonding

Implementation Method 3

the sealing resin and the semiconductor element relatively move based on the difference in thermal expansion coefficients between the semiconductor element and the sealing resin

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS9548262B2Method of manufacturing semiconductor package and semiconductor package

Publication Date: 2017.01.17 SHINDENGEN ELECTRIC MANUFACTURING CO LTD

AI summary

In a semiconductor package, surfaces of a die pad, a semiconductor element, a connecting member, and a lead are subjected to a surface treatment with a silane coupling agent. A first surface of a plurality of surfaces of the semiconductor device includes a first region where an organic substance is exposed, and a second region where an inorganic substance is exposed, the first surface being bonded with the connecting member. A bonding strength between the first region and the sealing resin is weaker than a bonding strength between the second region and the sealing resin.