Silane Deformed Layer for Flexible Display Substrate Separation
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Solution Overview
Problem
Manufacturing flexible display devices using polymer or ultrathin glass substrates faces challenges in preventing damage to thin film transistors during separation from support substrates and requires high processing costs, with existing methods being inefficient in terms of time and precision.
Innovation Solution
A method involving the formation of a deformed layer on a support substrate using a silane coupling agent, followed by UV treatment and heat treatment, allows for the separation of the thin film substrate without causing thermal or mechanical damage to the thin film transistors, using a silane coupling agent represented by Chemical Formula 1, and forming a polysilicon layer with conductive impurity ions at temperatures of 300°C or higher.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a polymer substrate or ultrathin glass substrate is attached on a support substrate and then separated in the final step, then the display device can be manufactured using conventional facilities, but the thin film transistor may be damaged during separation
Solution Approach 1:
A release layer is introduced as an intermediary between the thin film substrate and the support substrate. This release layer facilitates easy separation while preventing damage to the thin film transistor, resolving the contradiction between manufacturing ease and device reliability
Solution Approach 2:
The release layer is formed in advance on the support substrate before attaching the thin film substrate. This preliminary action ensures that the separation process will not damage the thin film transistor when the time comes
2Manufacturing precision
If high temperature heat treatment is performed to activate conductive impurity ions, then the pixel formation is complete, but the thin film transistor may suffer thermal damage
Solution Approach 1:
The release layer acts as a protective cushion that absorbs thermal stress during high temperature heat treatment. This beforehand cushioning allows the necessary thermal processing for pixel formation while protecting the thin film transistor from thermal damage
3Ease of operation
If the thin film substrate is separated from the support substrate, then the flexible display device is completed, but the separation process takes too much time
Solution Approach 1:
The release layer serves as a mediator that enables rapid separation of the thin film substrate from the support substrate. Its special properties allow the separation process to be completed quickly without compromising ease of operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient separation of polymer or ultrathin glass substrates from support substrates without damaging thin film transistors, reduces processing costs, and facilitates the formation of flexible display devices with improved reliability and reduced processing time.
Implementation Method 1
forming a deformed layer on a support substrate by a silane coupling agent
Implementation Method 2
performing UV treatment on the deformed layer
Implementation Method 3
The activation may be carried out at a temperature of 300° C. or higher. The heat treatment may be carried out at a temperature of 300° C. to 450° C.
Implementation Method 4
By forming a flexible display device according to the present invention, no thermal or mechanical damage is inflicted on thin film transistors and light emitting diodes of a display panel when the support substrate and the display panel are separated from each other
Data Source
AI summary
A method for manufacturing a display device includes: forming a deformed layer on a support substrate by a silane coupling agent; performing UV treatment on the deformed layer; forming a thin film substrate on the deformed layer; forming a pixel and an encapsulation member on the thin film substrate; and separating the support substrate from the thin film substrate.