Silane-Modified Dielectric Composite Films for Copper Adhesion
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Solution Overview
Problem
There is a need for dielectric composites with improved mechanical properties, adhesion to copper, and low dielectric properties, particularly high tensile strength, tensile elongation, and low relative permittivity and loss tangent at high frequencies, while also requiring processing at lower temperatures without excessive time.
Innovation Solution
A dielectric composite material comprising 20-50 weight % thermosetting resin and 50-70 weight % surface-modified inorganic particulate filler, where the filler is modified with acrylic-based silane coupling agents, and the resin is selected from arylcyclobutene, vinyl radical cured polymers, bismaleimide thermosets, or epoxy thermosets, allowing for the formation of films with enhanced properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional dielectric composites are used, then processing can be performed at standard temperatures, but the mechanical properties and adhesion to copper are insufficient
Solution Approach 1:
The patent modifies the chemical composition parameters of the dielectric composite by incorporating specific ratios of thermosetting resin (20-50 wt%) and surface-modified inorganic particulate filler (50-70 wt%), where the filler is modified with acrylic-based silane coupling agents. This parameter optimization enables the material to achieve high tensile strength while being processable at reduced temperatures
Solution Approach 2:
The invention creates a composite material system combining organic thermosetting resin with inorganic particulate filler that has been surface-modified with silane coupling agents. This composite structure synergistically improves mechanical properties and adhesion to copper while maintaining low processing temperature requirements
2Strength
If conventional dielectric composites are used, then standard processing times can be maintained, but adhesion to copper and mechanical properties are inadequate
Solution Approach 1:
The patent introduces acrylic-based silane coupling agents as intermediary substances that chemically bond to both the inorganic particulate filler and the thermosetting resin matrix, and also enhance adhesion to copper substrates. This intermediary layer significantly improves interfacial adhesion strength while allowing processing to proceed within acceptable timeframes
3Quantity of substance
If high filler content is used to reduce dielectric constant, then low dielectric properties are achieved, but mechanical properties deteriorate
Solution Approach 1:
The patent optimizes the quantitative composition by maintaining filler content at 50-70 wt% while simultaneously optimizing the resin content at 20-50 wt%. This balanced parameter selection ensures sufficient filler loading for low dielectric properties while maintaining adequate mechanical properties through the thermosetting resin matrix
Solution Approach 2:
The silane coupling agents act as intermediaries that improve the interfacial bonding between the inorganic filler particles and the organic resin matrix. This enhanced interfacial adhesion prevents stress concentration at particle-matrix interfaces, thereby maintaining tensile elongation and other mechanical properties even at high filler loadings
4Productivity
If processing temperature is reduced to save energy and time, then processing efficiency improves, but material properties may be compromised
Solution Approach 1:
The patent selects thermosetting resins and inorganic fillers with specific chemical and physical parameters that enable curing and bonding at reduced temperatures. The silane-modified filler and thermosetting resin system is designed to achieve complete crosslinking and adhesion at lower processing temperatures, ensuring material reliability is maintained
Solution Approach 2:
The composite material system is specifically designed with components that have complementary thermal and mechanical properties. The thermosetting resin provides a rigid crosslinked network that sets at lower temperatures, while the silane-modified filler reinforces the structure, together ensuring material properties are achieved at reduced processing temperatures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves good tensile strength, tensile elongation, adhesion to copper, and low dielectric loss at high frequencies, with Dk values less than 3.0 and Df values less than 0.004, processed at reduced temperatures, suitable for electronic device applications.
Implementation Method 1
the inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents
Data Source
AI summary
There is provided a dielectric composite material comprising (a) 20-50 weight % total solids of at least one thermosetting resin and other resin components; and (b) 50-70 weight % total solids of at least one inorganic particulate filler; where the at least one inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents.