Silane-Modified Epoxy Barrier for OLED Encapsulation
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Solution Overview
Problem
Organic light emitting diodes (OLEDs) face issues with moisture and oxygen ingress leading to material oxidation, performance deterioration, and reduced lifespan due to high water vapor transmission rates and outgas generation, which existing sealing methods fail to adequately address.
Innovation Solution
A photocurable composition comprising a photocurable monomer and a silicon-containing monomer, which forms a barrier layer with reduced water vapor transmission rate and outgas generation, ensuring a long-lasting encapsulation and minimizing curing shrinkage stress through high photocuring rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sealing methods (silicone compounds or polymer resins) are used to protect OLEDs, then basic sealing is achieved, but water vapor transmission rate and outgas generation remain high
Solution Approach 1:
The patent uses a composite material consisting of silane-modified epoxy resin combined with specific silane compounds (tetraethyl orthosilicate, methyl trimethoxysilane, and/or methyl tetramethoxysilane). This composite formulation creates a barrier layer that simultaneously achieves low water vapor transmission rate and low outgas generation, resolving the contradiction between basic sealing and harmful factor reduction.
Solution Approach 2:
The patent changes the chemical composition parameters of the sealing material by incorporating silane-modified epoxy resin with specific silane additives. This parameter change transforms the material properties to achieve both excellent barrier performance against water vapor and minimal outgas generation, overcoming the limitations of conventional silicone or polymer-based sealants.
2Productivity
If high photocuring rate is achieved to improve manufacturing efficiency, then productivity increases, but curing shrinkage stress increases causing layer shift
Solution Approach 1:
The patent modifies the chemical composition parameters by using silane-modified epoxy resin combined with specific silane compounds. This composition change enables the material to maintain low shrinkage stress during curing while achieving high photocuring rate, thus resolving the contradiction between manufacturing efficiency and positioning precision.
Solution Approach 2:
The patent introduces local quality enhancement by incorporating specific silane compounds (tetraethyl orthosilicate, methyl trimethoxysilane, and/or methyl tetramethoxysilane) into the epoxy resin system. These additives locally modify the curing characteristics to reduce shrinkage stress in critical areas while maintaining overall high curing speed, preventing layer shift during encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces water vapor transmission and outgas generation, ensuring a long lifespan of encapsulated apparatuses by forming a stable barrier layer with low curing shrinkage stress, thus preventing material degradation and performance decline in OLEDs.
Implementation Method 1
a photocurable composition may include: (A) a photocurable monomer and (B) a silicon containing monomer
Data Source
AI summary
The present invention relates to a photocurable composition, to a barrier layer including same, and to an encapsulated device including same, wherein the composition comprises a photocurable monomer(A) and a silicon containing monomer(B), wherein the silicon containing monomers(B) has a structure according to Formula 1.