Silane Hybrid Insulator Composition for Organic Thin Film Transistors
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Solution Overview
Problem
The challenge is to develop an insulator composition that enhances the processability and crosslinkability of insulating films for organic thin film transistors, which are essential for flexible and cost-effective displays, as inorganic materials are costly and require high-temperature vacuum processes, while organic materials need a rigid and dense insulating film to withstand extreme conditions.
Innovation Solution
A composition comprising a silane-based organic-inorganic hybrid material with multiple bonds, an acrylic organic crosslinking agent, and a silane-based crosslinking agent with six or more alkoxy groups, which improves crosslinkability and facilitates the fabrication of organic thin film transistors by forming a highly crosslinked and rigid insulating film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic semiconductor materials are used for thin film transistors, then device performance and stability are improved, but manufacturing cost increases and high-temperature vacuum processes are required
Solution Approach 1:
The patent employs organic-inorganic hybrid materials combining organic semiconductor compounds with inorganic metal oxide nanoparticles or molecular clusters. This composite approach allows the material to exhibit both the high stability and charge transport properties of inorganic materials and the low-cost, solution-processability of organic materials, thereby resolving the contradiction between device performance and manufacturing ease
Solution Approach 2:
The patent modifies the physical and chemical parameters of organic semiconductor materials by introducing specific functional groups, adjusting molecular weight, controlling crystallinity, and optimizing film morphology. These parameter changes enable organic materials to achieve performance levels comparable to inorganic materials while maintaining their processing advantages
2Ease of manufacture
If organic semiconductor materials are used to reduce cost and simplify processing, then manufacturing ease is improved, but the insulating film requires higher crosslinking density to withstand extreme conditions
Solution Approach 1:
The patent creates crosslinked hybrid networks where organic polymer chains are chemically bonded to inorganic metal oxide clusters through silane linkers or other coupling agents. This composite structure provides both the flexibility and processability of organic materials and the rigidity, chemical resistance, and thermal stability of inorganic materials, satisfying the requirement for high crosslinking density without sacrificing ease of manufacture
Solution Approach 2:
The patent incorporates crosslinking functional groups (such as epoxide, isocyanate, or silane groups) into the insulating film formulation before deposition. These pre-installed reactive groups undergo crosslinking reactions during or after film formation, creating the required rigid and chemically resistant network structure in advance before the device undergoes extreme processing conditions
3Reliability
If the insulating film is highly crosslinked to withstand chemicals and extreme conditions, then reliability is improved, but processability during fabrication deteriorates
Solution Approach 1:
The patent employs crosslinking mechanisms that can be dynamically controlled - remaining dormant during fabrication processes and activating only when needed. This is achieved through temperature-responsive crosslinking, moisture-curing mechanisms, or UV-triggered crosslinking that occurs after all fabrication steps are complete, thereby maintaining film flexibility and processability during manufacturing while achieving high crosslinking density for final device reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed composition enables improved processability and stability of insulating films, allowing for the efficient fabrication of organic thin film transistors that can withstand chemical exposure and extreme processing conditions, making them suitable for flexible and cost-effective display applications.
Implementation Method 1
the silane-based organic-inorganic hybrid material may be an organic silane compound... with the proviso that at least one of X1, X2 and X3 is a hydrolyzable group
Implementation Method 2
a silane-based organic-inorganic hybrid material containing one or more multiple bonds, an acrylic organic crosslinking agent and a silane-based crosslinking agent having six or more alkoxy groups
Implementation Method 3
an acrylic organic crosslinking agent and a silane-based crosslinking agent having six or more alkoxy groups to exhibit improved processability when used to form an insulating film
Data Source
AI summary
Disclosed herein is a composition for producing an insulator. More specifically, the composition comprises a silane-based organic-inorganic hybrid material containing one or more multiple bonds, an acrylic organic crosslinking agent and a silane-based crosslinking agent having six or more alkoxy groups. Also disclosed herein is an organic insulator produced using the insulator composition. The organic insulator is highly crosslinked to facilitate the fabrication of an organic thin film transistor in terms of processing.