Silane Organic Layer Adhesion on Precious Metal Surfaces

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Solution Overview

Problem

Current layer structures in chip packages face challenges with adhesion promotion and corrosion barrier functions, particularly on precious metal surfaces where silane coupling is not possible, leading to delamination issues under reliability conditions such as high temperature and thermal cycling.

Innovation Solution

A method involving plasma-treating a metal surface to form nucleophilic groups, followed by depositing a silane-based organic layer that is covalently bonded to these groups, providing both adhesion promotion and corrosion barrier functions, even on precious metals, using atomic layer deposition (ALD) for oxide layer formation and plasma conditioning for surface optimization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a galvanic process (A2-treatment) is used to grow Cr/Zn-dendrites for adhesion promotion, then both corrosion protection and adhesion function are provided, but the process becomes complicated

Engineering Contradiction:
Improveadhesion and corrosion protectionVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and separates the two functions (adhesion promotion and corrosion protection) into distinct layers. The plasma-treated metal surface provides adhesion promotion through nucleophilic groups, while a separate corrosion barrier layer provides protection against corrosive substances. This eliminates the need for the complicated galvanic dendrite growth process while maintaining both functions.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The interface structure is segmented into multiple functional layers: a plasma-treated metal surface with nucleophilic groups for adhesion, and a separate corrosion barrier layer. This segmentation allows each layer to be optimized for its specific function, simplifying the overall process compared to the monolithic galvanic dendrite approach.

Inventive Principle:
Principle #1Segmentation

2Strength

If silane coupling is used for adhesion promotion on metal surfaces, then adhesion is enhanced, but it is not possible on precious metal surfaces leading to delamination

Engineering Contradiction:
Improveadhesion strengthVSAvoidcompatibility with precious metals
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent changes the chemical parameters of the metal surface through plasma treatment, creating nucleophilic groups (such as hydroxyl groups) on the surface. This parameter change enables covalent bonding with silane-based organic layers on precious metal surfaces where traditional silane coupling fails, thereby achieving adhesion enhancement while maintaining versatility across different metal types.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the interface between encapsulation material and device provides both adhesion and corrosion barrier functions, then reliability is improved, but the process complexity increases

Engineering Contradiction:
Improveprotection from corrosive substancesVSAvoidinterface structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the adhesion promotion function and corrosion barrier function into a integrated interface structure. The plasma-treated metal surface with nucleophilic groups serves as both the adhesion promoter and the base for the corrosion barrier layer, eliminating the need for separate galvanic treatment processes while providing both protection functions simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances adhesion and corrosion resistance, as demonstrated by increased shear force measurements under various test conditions, including high temperature and thermal cycling, without damaging the layer structure during packaging.

Implementation Method 1

plasma-treating a metal surface with a hydrogen-containing plasma, thereby forming nucleophilic groups over the metal surface

Methodology Applied
Scientific EffectPlasma treatment: Plasma

Implementation Method 2

forming an organic layer over the metal surface, wherein the organic layer comprises or consists of silane and is covalently bonded to the nucleophilic groups

Methodology Applied
Scientific EffectCovalent bonding: Chemical Bonding

Data Source

PatentUS11328935B2Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package
Publication Date: 2022.05.10 INFINEON TECHNOLOGIES AG
  • US11328935B2 patent drawing
  • US11328935B2 patent drawing
  • US11328935B2 patent drawing

AI summary

A method of forming a layer structure is provided. The method may include plasma-treating a metal surface with a hydrogen-containing plasma, thereby forming nucleophilic groups over the metal surface, and forming an organic layer over the metal surface, wherein the organic layer comprises silane and is covalently bonded to the nucleophilic groups.