Silane-Modified Polymer Adhesive for Electronic Encapsulation
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Solution Overview
Problem
Existing adhesives for encapsulating electronic devices are inadequate in providing a robust barrier against water vapor and oxygen, leading to reduced performance and lifespan due to permeation issues, especially in organic electronics, and often result in mechanical stress, thickness, and transparency limitations.
Innovation Solution
A silane-modified polymer-based pressure-sensitive adhesive with acid anhydride groups reacts with silanes to form a crosslinked network, offering improved barrier properties against water vapor and oxygen while maintaining flexibility and transparency, preventing bubble formation under heat and humidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional adhesives are used for encapsulation, then the structure is simple and easy to apply, but the barrier against water vapor and oxygen is insufficient leading to reduced lifespan
Solution Approach 1:
The adhesive comprises a polymer matrix combined with inorganic barrier particles (such as metal oxides, phosphates, or silicates) to create a composite material that provides both adhesive functionality and enhanced barrier properties against water vapor and oxygen permeation
Solution Approach 2:
The patent modifies the chemical composition and physical structure of the adhesive by incorporating specific inorganic compounds and adjusting formulation parameters to achieve optimal barrier performance while maintaining adhesion and flexibility
2Reliability
If glass or metal substrates are used for inflexible structures, then the permeation barrier is high, but the structure is susceptible to mechanical stress and causes large thickness
Solution Approach 1:
The invention uses flexible polymer-based adhesive layers that can conform to mechanical stress while providing effective permeation barriers, replacing rigid glass or metal substrates with thin, flexible encapsulation structures
Solution Approach 2:
The adhesive combines organic polymer matrices with inorganic barrier particles to create a composite material that provides both flexibility for mechanical stress resistance and effective permeation barrier properties
3Reliability
If metal substrates are used, then the permeation barrier is high, but there is no transparency
Solution Approach 1:
The patent employs thin polymer film-based adhesives that are inherently transparent or can be formulated to be transparent, replacing opaque metal substrates while maintaining flexible encapsulation capabilities
Solution Approach 2:
The adhesive uses transparent polymer matrices combined with inorganic barrier particles that maintain optical transparency while providing effective permeation barriers against water vapor and oxygen
4Adaptability or versatility
If surface substrates such as films are used for flexible arrangements, then the structure is flexible and thin, but the seal quality is insufficient
Solution Approach 1:
The adhesive comprises a polymer matrix combined with inorganic barrier particles (such as metal oxides, phosphates, or silicates) to create a composite material that provides both adhesive functionality and enhanced barrier properties against water vapor and oxygen permeation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive provides a significant increase in breakthrough time for water vapor, ensuring the longevity of electronic components by maintaining excellent adhesion and cohesion at elevated temperatures, and allowing for flexible, thin, and transparent encapsulation without the need for additional thermal or irradiation processes.
Implementation Method 1
A silane-modified polymer resulting from the reaction a) a polymer containing acid anhydride groups with b) a silane... and containing a crosslinker
Implementation Method 2
A good adhesive for sealing (opto-)electronic components has a low permeability to oxygen and in particular to water vapor
Implementation Method 3
The flexible adhesive solutions should therefore not only achieve good adhesion between two substrates
Implementation Method 4
the penetration of water or Water vapor is considered a major problem. Protection through encapsulation is therefore required
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to an adhesive compound containing I. a silane-modified polymer produced by reacting a. a polymer which contains acid anhydride groups with b. a silane having the following formula where R1, R2, R3 are selected independently of each other from the group consisting of methyl, ethyl, 2-methoxyethyl, i-propyl, butyl, m = 0 or 1, n = 0 to 12, p = 1 or 2, and for p = 1, Y = a functional group selected from the group consisting of glycidyl, glycidyloxy, isocyanato, -NH-CH2-CH2-NR4R5, -NR4R5 (with R4 and R5 being selected independently of each other from the group consisting of H, alkyl, phenyl, benzyl, cyclopentyl, cyclohexyl), SH, or for p = 2, Y = NH, II. and containing a cross-linking agent.