Silane-Modified Epoxy Resin for PCB Laminate Adhesion
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Solution Overview
Problem
Current laminates for printed circuit boards face issues with adhesiveness, heat resistance, insulation properties, and formability due to limitations in thermoplastic polyimide and epoxy resin compatibility, which lead to cracking and reduced performance during high-temperature curing.
Innovation Solution
A resin composition comprising a rubber-modified epoxy resin, an epoxy resin, an inorganic filler, and a curing agent, with specific weight ratios and molecular weights, is applied to a metal base layer to enhance adhesiveness, heat resistance, and insulation properties, and is cured under controlled conditions to form a laminate with improved formability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermoplastic polyimide is used as adhesive and cured under high temperature conditions, then adhesive force between metal base layer and insulation film increases, but photo solder resist cracks occur during oxidation of metal base layer
Solution Approach 1:
The patent modifies the curing temperature parameter from high temperature (conventional thermoplastic polyimide curing) to low temperature (below 100°C), thereby maintaining adhesive force while preventing photo solder resist cracking during the curing process
Solution Approach 2:
The patent introduces a silane-modified epoxy resin as an intermediary adhesive material that enables bonding between metal base layer and insulation film at low temperatures, avoiding the harmful effects of high temperature curing while maintaining strong adhesion
2Strength
If epoxy resin is used as adhesive to increase adhesive force, then adhesiveness improves, but heat resistance deteriorates due to compatibility issues with insulation film
Solution Approach 1:
The patent creates a composite adhesive system combining silane-modified epoxy resin with specific inorganic fillers (alumina, aluminum hydroxide, magnesium hydroxide) and curing agents, achieving both high adhesiveness and heat resistance through material composition optimization
Solution Approach 2:
The patent modifies the chemical composition parameters of the epoxy resin by incorporating silane modification and specific inorganic fillers, thereby improving both adhesiveness and heat resistance simultaneously through compositional optimization
3Strength
If rubber is mixed with epoxy resin to improve adhesiveness and formability, then adhesiveness and formability improve, but heat resistance and insulation properties deteriorate
Solution Approach 1:
The patent removes rubber components from the adhesive composition entirely, replacing them with silane-modified epoxy resin and inorganic fillers that provide both adhesiveness and heat resistance without the detrimental effects of rubber on insulation properties
Solution Approach 2:
The patent develops a composite adhesive material using silane-modified epoxy resin combined with specific inorganic fillers and curing agents, achieving a balance of adhesiveness, formability, heat resistance, and insulation properties without rubber additives
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate exhibits excellent adhesiveness, heat resistance, and formability, with the resin composition providing high adhesion strength and insulation properties, while maintaining manufacturing efficiency and cost-effectiveness.
Implementation Method 1
a silane-modified epoxy resin which has a specific structure and undergoes curing at a low temperature
Implementation Method 2
it has been found that when a silane-modified epoxy resin having a specific structure is used, adhesion to an aluminum foil is enhanced due to reaction between a silane group and a hydroxyl group on a surface of the aluminum foil
Implementation Method 3
an insulation layer which conducts heat emitted from the electronic device
Data Source
Figure 1~3
AI summary
The present disclosure relates to a resin composition, which serves as an insulation layer of a laminate for a printed circuit board while exhibiting adhesiveness to a metal base layer, the resin composition including: a rubber-modified epoxy resin; an epoxy resin; an inorganic filler; and a curing agent.