Silane-Modified Phenolic Resin for Void-Free High Heat Resistance
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Solution Overview
Problem
Conventional epoxy resin curing agents generate volatile by-products like alcohols during curing, leading to voids and reduced heat resistance in hardened products, and result in increased molecular weight and gelation issues, limiting their effectiveness in high-temperature electronic applications.
Innovation Solution
A novel curable resin is developed through the reaction of silane compounds with phenol compounds, minimizing volatile components to 10 wt% or less, and incorporating aryloxysilyl bonds, which improves heat resistance and handleability by controlling molecular weight and reducing void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If alkoxy group-containing silane-modified epoxy resin or phenol resin is used as a curing agent, then heat resistance of epoxy resin hardened product is improved, but volatile components (alcohols) are generated during curing reaction leading to voids and increased curing shrinkage ratio
Solution Approach 1:
The invention changes the chemical structure parameter of the curing agent by using silane-modified phenolic resin instead of conventional alkoxy group-containing silane-modified epoxy resin or phenol resin. This structural change allows the curing reaction to proceed without generating volatile alcohol by-products, thereby eliminating void formation while maintaining improved heat resistance of the hardened product.
Solution Approach 2:
The invention converts the potential harm of silane modification (which typically introduces volatile by-products) into a benefit by selecting a specific phenolic resin structure that enables non-volatile curing. The silane-modified phenolic resin undergoes curing reaction to form a crosslinked network structure that provides both void-free morphology and enhanced heat resistance, turning the usual harmful volatile generation into a beneficial void-free hardened product with improved thermal properties.
2Object-generated harmful factors
If resin with almost no volatile component is used, then void formation is reduced, but molecular weight increases leading to gelation and decreased handleability efficiency
Solution Approach 1:
The invention optimizes the molecular weight parameter of the silane-modified phenolic resin to fall within the specific range of 500-5000. This parameter control ensures that the resin maintains low viscosity and good fluidity for easy handling and application, while simultaneously preventing premature gelation during storage and processing. The controlled molecular weight allows the resin to remain workable despite having minimal volatile content.
3Ease of operation
If conventional curing agents are used, then handleability is maintained, but heat resistance of hardened product is insufficient for high-temperature electronic applications
Solution Approach 1:
The invention creates a composite curing agent system by combining silane modification with phenolic resin structure. This composite material approach integrates the beneficial properties of both components: the silane groups provide crosslinking capability for enhanced heat resistance, while the phenolic resin backbone maintains good handleability and processability. The resulting material achieves both ease of operation during application and superior heat resistance in the hardened state, making it suitable for high-temperature electronic applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel curable resin enhances heat resistance and reliability of electronic devices by minimizing voids and cracks, providing a high-reliability epoxy resin composition for sealing electronic components like ICs and LSIs.
Implementation Method 1
a curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b)
Data Source
AI summary
A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent.[Formula 1]R1nSiR2(4-n) (I-1)(Wherein, n denotes a number of 0 to 2; R1 represent a hydrogen atom, or substituted or unsubstituted hydrocarbon groups having 1 to 18 carbon atoms; R2 represent a halogen atom, a hydroxyl group, substituted or unsubstituted oxy groups, amino groups, and carbonyloxy groups having 1 to 18 carbon atoms; and two or more of R1 and R2 may bind to each other to form a cyclic structure).