Silanol Hybrid Resist Coatings for Low-LER EUV Patterning
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Solution Overview
Problem
Existing photoresist materials for extreme ultraviolet lithography (EUVL) face challenges with high line-edge roughness (LER), sensitivity, and etch resistance, particularly in chemically amplified resists (CAR) and metal-containing resists, which affect the performance and stability of pattern formation in microelectronic devices.
Innovation Solution
Incorporating silanol groups into hydrogen silsesquioxane resin coatings, along with metal oxide compounds, enhances sensitivity and solubility, allowing for high-resolution patterning through hydrolyzed precursor solutions that can be patterned with masked radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If chemically amplified resists (CAR) are used to improve sensitivity, then sensitivity is improved, but line-edge roughness (LER) increases
Solution Approach 1:
The patent employs a composite material system consisting of silsesquioxane resin combined with metal oxide nanoparticles (such as hafnium oxide, zirconium oxide, or titanium oxide). This composite structure integrates the high sensitivity of metal-containing materials with the low LER characteristics of inorganic resins, achieving both improved sensitivity and reduced line-edge roughness simultaneously
Solution Approach 2:
The patent modifies the chemical composition parameters of the resist material by incorporating specific ratios of silsesquoxane to metal oxide compounds, and by controlling the molecular weight and functional groups of the polymer chains. These parameter changes enable optimization of both sensitivity and LER performance
2Use of energy by moving object
If metal-containing resists are used to improve sensitivity, then sensitivity is improved, but line-edge roughness (LER) increases and metal contamination occurs
Solution Approach 1:
The patent distributes metal oxide nanoparticles locally within the silsesquoxane resin matrix at controlled concentrations (0.1-10 wt%). This local incorporation provides sensitivity enhancement only where needed, while maintaining the overall low LER characteristics of the inorganic resin and minimizing metal contamination risks
Solution Approach 2:
The patent uses metal oxide nanoparticles as sacrificial sensitivity enhancers that can be effectively removed during processing, allowing the resist to achieve high sensitivity during exposure while minimizing permanent metal contamination in the final device structure
3Manufacturing precision
If conventional hydrogen silsesquioxane resin is used to reduce LER, then LER is reduced, but sensitivity deteriorates
Solution Approach 1:
The patent creates a composite material combining silsesquoxane resin with metal oxide compounds, where the silsesquoxane provides the low LER foundation and the metal oxide nanoparticles provide the sensitivity enhancement, achieving both low LER and high sensitivity simultaneously
Solution Approach 2:
The patent modifies the resist composition by incorporating metal oxide compounds at optimized concentrations and controlling the silsesquoxane polymer structure (molecular weight, functional groups), thereby improving sensitivity while maintaining the low LER characteristics of the inorganic resin matrix
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silanol-containing polyhydridosilsesquioxane resins demonstrate improved sensitivity, reduced line-edge roughness, and enhanced etch resistance, enabling high-resolution patterning suitable for EUVL without excessive metal contamination, simplifying the lithographic stack and facilitating industrial application.
Implementation Method 1
Elements which have high molar absorptivity of 13.5 nm EUV photons are metals. Thus, there has been an increasing interest in metal containing resists where the metal is added to other resist materials to improve sensitivity
Implementation Method 2
Incorporating silanol groups into hydrogen silsesquioxane resin coatings, along with metal oxide compounds, enhances sensitivity and solubility, allowing for high-resolution patterning through hydrolyzed precursor solutions
Data Source
AI summary
Silanol-containing organic-inorganic hybrid coatings on semiconductor substrates for forming patterns thereon. The present coatings can be produced by coating of semiconductor substrates with metal and silanol containing polyhydridosilsesquioxane resin solutions. Provided herein is also a method for patterning a metal and silanol containing polyhydridosilsesquioxane coated substrate with radiation of light at a specific wavelength, the method comprising the steps of irradiating a coated substrate along a selected pattern to form an irradiated structure with a region of irradiated coating and a region with un-irradiated coating and selectively developing the irradiated structure to remove a substantial portion of the un-irradiated coating to form a patterned substrate. The invention allows for obtaining a preselected silanol content polyhydridosilsesquioxane resin, and adjustment of the silanol content will make it possible to obtain a highly sensitive coating for application in EUV.