Silazane-Based Encapsulation Films for Flexible OLED Moisture Blocking

The patent replaces rigid glass substrates with thin film encapsulation layers (silicon oxide, silicon nitride, or organic polymer films) that can be deposited directly on flexible substrates like PET or PEN. This enables the OLED device to achieve flexibility while maintaining protection through multiple thin film layers totaling 1-5 micrometers thickness, dramatically reducing both thickness and improving adaptability compared to traditional glass packaging.

The patent employs composite encapsulation structures combining multiple inorganic layers (silicon oxide, silicon nitride) with organic polymer layers. This multi-layer composite approach creates a synergistic effect where each layer compensates for the weaknesses of others, preventing pinhole formation and moisture permeation while maintaining thin overall thickness. The combination achieves superior moisture blocking capability compared to single-material encapsulation.

The patent combines organic polymer films (providing flexibility) with inorganic thin film layers (providing superior moisture and oxygen blocking). The inorganic layers act as barriers to permeation while the polymer layers maintain flexibility and provide stress relief. This composite structure achieves both flexibility and excellent moisture blocking ability, overcoming the limitations of pure polymer encapsulation.

The patent uses silane-based precursor materials that can form multiple protective functions through a single deposition process. The silane compounds can simultaneously create silicon oxide, silicon nitride, or hybrid layers depending on processing conditions, providing moisture blocking, mechanical protection, and stress management in one encapsulation step. This reduces manufacturing complexity compared to depositing multiple separate layers with different materials.