Silica-Based Layer Coating Composition for Bubble-Free Film Formation
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Solution Overview
Problem
The formation of silica-based layers in semiconductor and display devices often results in defects and bead generation due to bubble formation during the coating process, leading to reduced yield and increased manufacturing costs.
Innovation Solution
A composition comprising a silicon-containing polymer with specific polydispersity and viscosity ranges, along with a solvent and optional thermal acid generator and surfactant, is used to form a silica-based layer, which minimizes bubble formation and ensures uniformity and flatness during the coating process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon-containing material is coated and cured to form a silica based layer, then the layer can serve as an interlayer insulating layer or protective layer, but bubbles may be generated during preparation and coating, causing defects on the silica based layer
Solution Approach 1:
The patent changes the physical and chemical parameters of the coating composition, specifically controlling the viscosity within 1-10 cP and the molecular weight of the silicon-containing polymer within 1,000-10,000. These parameter optimizations prevent bubble formation during coating while ensuring proper film formation and curing characteristics.
2Object-generated harmful factors
If the viscosity of the coating composition is not properly controlled, then bubble generation occurs during coating, but adjusting viscosity may affect the film formation and curing properties
Solution Approach 1:
The patent establishes a specific viscosity range (1-10 cP) and molecular weight range (1,000-10,000) for the silicon-containing polymer that simultaneously prevents bubble formation and ensures proper film formation. This precise parameter control resolves the contradiction between reducing bubbles and maintaining film quality.
Solution Approach 2:
The patent uses a polymer with controlled molecular weight and polydispersity that provides dynamic flow characteristics during coating, allowing the composition to level out and form uniform films while maintaining low enough viscosity to prevent bubble entrapment.
3Strength
If high molecular weight silicon-containing polymer is used, then the composition may have better film strength, but the viscosity increases causing bubble generation during coating
Solution Approach 1:
The patent optimizes the molecular weight to a specific range (1,000-10,000) that provides sufficient film strength after curing while keeping the viscosity low enough (1-10 cP) to prevent bubble formation during the coating process.
Data Source
AI summary
A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25° C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.