Silica Layer Composition Defect Reduction via Particulate Removal
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Solution Overview
Problem
In the manufacturing of semiconductor memory cells, such as DRAM, the formation of silica layers with reduced defects is challenging due to the presence of high molecular weight particulates that can lead to voids and defects in the layer, affecting the quality of electric characteristics.
Innovation Solution
A composition comprising hydrogenated polysilazane or hydrogenated polysiloxazane with a weight average molecular weight reduced to polystyrene of greater than or equal to 50,000, at a concentration of 0.1 wt % or less, is used, along with a method involving co-ammonolysis and precipitation of insoluble precipitates to remove high molecular weight particulates, followed by curing in a water vapor-containing atmosphere at 200°C or higher.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional composition is used for forming silica layer, then the composition can be easily manufactured, but high molecular weight particulates cause voids and defects in the silica layer
Solution Approach 1:
The patent applies extraction by removing high molecular weight particulates (with weight average molecular weight of 50,000 or more) from the composition through selective precipitation. This is achieved by controlling the concentration of such particulates to be 0.1 wt% or less based on the total amount of hydrogenated polysilazane and hydrogenated polysiloxazane, thereby eliminating the harmful factors that cause voids and defects in the silica layer.
Solution Approach 2:
The patent applies parameter changes by precisely controlling the concentration parameter of high molecular weight particulates. By setting the concentration of particulates with weight average molecular weight of 50,000 or more to 0.1 wt% or less, the patent transforms the composition quality to eliminate defects while maintaining the desired silica layer formation properties.
2Stability of the object's composition
If high molecular weight polysilazane/polysiloxazane is present in the composition, then the composition has sufficient stability, but it creates defects and voids in the silica layer
Solution Approach 1:
The patent applies parameter changes by optimizing the concentration parameter of high molecular weight components. By controlling the weight average molecular weight distribution and limiting particulates with Mw≥50,000 to 0.1 wt% or less, the patent achieves both composition stability and high manufacturing precision with reduced defects.
Solution Approach 2:
The patent applies local quality by differentiating the treatment of different molecular weight components. While maintaining sufficient high molecular weight content for stability, the patent selectively removes excessive high molecular weight particulates (Mw≥50,000) that cause defects, creating a differentiated quality distribution in the composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in a silica layer with a significantly reduced number of defects, improving the quality of electric characteristics and enabling the production of high-quality semiconductor devices.
Implementation Method 1
co-ammonolyzing the halosilane in the solvent to synthesize a hydrogenated polysilazane or a hydrogenated polysiloxazane
Implementation Method 2
precipitating an insoluble precipitate by adding an additional solvent to the resultant solution
Implementation Method 3
curing the composition in a water vapor-containing atmosphere at a temperature of about 200° C. or higher
Data Source
AI summary
A composition for forming a silica layer, a method of manufacturing the composition, a silica layer prepared using the composition, and a method of manufacturing the silica layer, the composition including hydrogenated polysilazane, hydrogenated polysiloxazane, or a combination thereof, wherein a concentration of a sum of hydrogenated polysilazane and hydrogenated polysiloxazane having a weight average molecular weight, reduced to polystyrene, of greater than or equal to about 50,000 is about 0.1 wt % or less, based on a total amount of the hydrogenated polysilazane and hydrogenated polysiloxazane.