Silica Layer Forming Composition for Void-Minimized Gap Filling
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Solution Overview
Problem
The formation of silica layers in flat panel display devices often results in voids due to gas generation during the conversion of silicon-containing polymers, which affects the yield and reliability of the devices.
Innovation Solution
A composition for forming a silica layer is developed, comprising a silicon-containing polymer and a solvent, where the gas generated from this composition under specific conditions satisfies certain ratios of hydrogen gas, silane gas, and ammonia gas, thereby minimizing void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon-containing polymer is converted to a silica layer, then a silica layer is formed for use as an insulation layer, but gases such as hydrogen gas, ammonia gas, and silane gas are generated causing voids inside the silica layer
Solution Approach 1:
The patent applies parameter changes by carefully controlling the composition ratios of silicon-containing polymer, solvent, and catalyst, along with controlling the curing temperature and time parameters. This optimization of parameters minimizes gas generation during the conversion process while ensuring complete conversion to silica, thereby reducing voids and improving device reliability
Solution Approach 2:
The patent converts the harmful effect of gas generation into a beneficial process by using the generated gases as indicators to optimize the curing process. By controlling the decomposition and conversion process to manage gas evolution, the patent achieves complete polymer conversion to silica while minimizing void formation, turning a potentially harmful byproduct into a process control parameter
2Manufacturing precision
If the silicon-containing polymer is converted to silica, then the insulation layer is formed, but the yield and reliability of the device are adversely affected due to voids
Solution Approach 1:
The patent applies preliminary action by pre-optimizing the composition formulation before the actual silica layer formation process. The specific ratios of silicon-containing polymer (0.1-30 wt%), solvent (70-99.9 wt%), and catalyst are predetermined to ensure optimal conversion with minimal gas generation, preventing void formation before it occurs and ensuring high manufacturing precision and device yield
3Ease of manufacture
If a conventional composition is used to form the silica layer, then the conversion process is simple, but the number of voids inside the silica layer increases
Solution Approach 1:
The patent applies composite materials by formulating a multi-component composition system consisting of silicon-containing polymer, solvent, and catalyst in specific ratios. This composite formulation achieves both ease of manufacture (simple coating and curing steps) and manufacturing precision (minimized voids through optimized composition that controls gas generation during conversion)
Solution Approach 2:
The patent uses parameter changes by optimizing the composition parameters (polymer concentration 0.1-30 wt%, solvent type and amount, catalyst selection and quantity) to achieve a balance between process simplicity and void minimization. The specific parameter ranges are determined to maintain ease of application while ensuring high-quality silica layer formation with minimal defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of this composition leads to a silica layer with minimized voids, improving the yield and reliability of electronic devices by enhancing the gap filling and maintaining a low etch-rate during the curing process.
Implementation Method 1
a silica layer formed by converting a silicon-containing polymer to silica
Implementation Method 2
while the silicon-containing polymer is converted to a silica layer, gases such as hydrogen gas, ammonia gas, and silane gas may be generated
Data Source
AI summary
Provided are a composition for forming a silica layer including a silicon-containing polymer and a solvent, wherein when adding 70 g of the composition for forming the silica layer to a 100 ml container, leaving it at 40° C. for 28 days, and taking 1 ml of gas generated from the composition, 1 ml of the gas includes hydrogen gas (H2), silane gas (SiH4), and ammonia gas (NH3), and the hydrogen gas, silane gas, and ammonia gas satisfy Equation 1: [(hydrogen gas amount (ppm))/(silane gas amount (ppm)+ammonia gas amount (ppm))≥1.5], a silica layer manufactured therefrom, and an electronic device including the silica layer.