Silica Xerogel Composite Heat-Insulation Sheet for Thin Devices
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Solution Overview
Problem
Conventional heat-insulation materials struggle to effectively insulate in narrow spaces within portable devices due to high thermal conductivity and mechanical weakness, leading to inadequate heat management as devices miniaturize and thin out.
Innovation Solution
A heat-insulation sheet comprising a composite layer with unwoven fabric fibers impregnated with a sol solution, converted into a gel, and then sandwiched between films to form silica xerogel layers on both surfaces, enhancing thermal insulation while maintaining mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If silica aerogels are used as heat-insulating material, then heat-insulation performance is improved, but mechanical strength deteriorates
Solution Approach 1:
The patent combines silica aerogel particles with a resin matrix to create a composite heat-insulation material. The resin binds the aerogel particles together, forming a structurally sound composite that maintains the low thermal conductivity of aerogel while gaining mechanical strength from the resin network.
Solution Approach 2:
The patent utilizes the porous structure of silica aerogel particles within the composite material. The high porosity (90% or more) of the aerogel particles provides excellent heat insulation performance while the particles are embedded in and supported by the resin matrix, solving the mechanical strength issue.
2Volume of moving object
If portable devices are downsized and thinned, then device size is reduced, but heat management capability deteriorates
Solution Approach 1:
The patent changes the thermal conductivity parameter by using silica aerogel-based composite material with extremely low thermal conductivity (around 15 mW/mK). This allows effective heat insulation in thin configurations, enabling portable devices to maintain low surface temperatures even when downsized and thinned.
Solution Approach 2:
The patent applies heat-insulation material specifically at critical locations where heat generation occurs, such as near semiconductor chips and other heat-generating components. This localized approach provides effective heat management in specific areas without requiring the entire device to be thickened.
3Temperature
If graphite sheet is used for heat dissipation, then local temperature rise is suppressed, but heat insulation capability deteriorates
Solution Approach 1:
The patent segments the thermal management function into two distinct layers: a graphite sheet layer for heat dissipation and temperature equalization, and a silica aerogel composite layer for heat insulation. This segmentation allows each layer to perform its specialized function optimally without interfering with the other.
Solution Approach 2:
The silica aerogel composite material acts as an intermediary layer between heat-generating components and the graphite heat dissipation sheet. It provides thermal isolation while allowing the graphite layer to effectively manage heat distribution, preventing heat from transferring to sensitive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a low thermal conductivity of 0.014 to 0.024 W/mK and reduced thickness variations, effectively insulating heat in limited spaces within portable devices, even when thin, thereby managing heat effectively in modern electronic devices.
Implementation Method 1
unwoven fabric fibers are impregnated with a sol solution, followed by converting the sol solution into a gel
Implementation Method 2
the heat-insulation sheet according to the disclosure exhibits a thermal conductivity lower than those of conventional heat-insulation sheets, the heat-insulation sheet produces sufficient heat-insulation effects
Data Source
AI summary
A heat-insulation sheet includes a first silica xerogel layer, a second silica xerogel layer, and a composite layer. The first silica xerogel layer includes a first silica xerogel, and the second silica xerogel layer includes a second silica xerogel. The composite layer is located between the first silica xerogel layer and the second silica xerogel layer, and includes at least one type of unwoven fabric fibers, and a third silica xerogel. The third silica xerogel is located in a spatial volume of the unwoven fabric fibers.