Silicon Transport Bag Laminate for Barrier Crack Resistance

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Solution Overview

Problem

Existing packaging materials for silicon materials used in semiconductor production fail to adequately reduce volatile components, prevent cracks in barrier layers, and prevent contamination during transportation, especially when the outer bag is damaged.

Innovation Solution

A packaging material composed of a laminate structure with specific elastic modulus differences between layers, including a resin base layer, barrier layer, resin layer, and sealant layer, where the sealant layer has a lower elastic modulus than the base layers, and a sealant base with a layered structure of low and linear low-density polyethylene to minimize volatile component release and improve sealing strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a barrier layer is provided in the packaging material to block permeation of oxygen and water vapor, then the barrier function is improved, but cracks may occur in the barrier layer during transportation

Engineering Contradiction:

Improvebarrier functionVSAvoidcrack resistance

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The packaging material uses a composite laminate structure consisting of a resin base layer, a barrier layer, and a resin layer. The barrier layer is sandwiched between two resin layers that have different elastic moduli, creating a composite material that maintains barrier function while preventing cracks through elastic modulus differentiation.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by creating a specific elastic modulus distribution within the packaging material. The resin layer adjacent to the barrier layer has a different elastic modulus than the resin base layer, allowing the structure to locally accommodate stress and prevent crack propagation in the barrier layer while maintaining overall barrier function.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If conventional packaging materials are used, then manufacturing simplicity is maintained, but volatile components cannot be adequately reduced and sealing strength is insufficient

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidvolatile components

Core Design Contradiction:

Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The sealant layer uses a composite structure with low-density polyethylene and linear low-density polyethylene in a specific ratio. This composite material composition reduces volatile component release while maintaining ease of manufacturing through conventional lamination processes and achieving superior sealing strength.

Inventive Principle:

Principle #40Composite materials

3Reliability

If a double bag structure is used with outer bag and inner bag, then protection against external damage is improved, but contamination can occur if the outer bag is damaged

Engineering Contradiction:

Improveprotection against damageVSAvoidcontamination risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces volatile components, prevents cracks in the barrier layer, and prevents contamination of the silicon material, even if the outer bag is damaged, by enhancing sealing strength and followability.

Implementation Method 1

an indentation elastic modulus (MPa) of the resin layer is smaller than an indentation elastic modulus (MPa) of each of the first resin base layer and the second resin base layer by one or more orders of magnitude

Methodology Applied

Scientific EffectStress absorption through elastic modulus differential: Elasticity

Implementation Method 2

an indentation elastic modulus (MPa) of the sealant layer is smaller than an indentation elastic modulus (MPa) of the first resin base layer and an indentation elastic modulus (MPa) of the second resin base layer by one or more orders of magnitude

Methodology Applied

Scientific EffectCompliant sealing through elastic modulus differential: Elasticity

Implementation Method 3

a packaging material used for a bag for transporting of a silicon material, wherein the packaging material is a laminate in which a first resin base layer, a barrier layer, a second resin base layer, a resin layer, and a sealant layer are laminated in that order

Methodology Applied

Scientific EffectVolatile component absorption through layered structure: Absorption (physical)

Data Source

PatentUS20260091925A1Sealant, bag for transporting and packaging of silicon material

Publication Date: 2026.04.02 DAI NIPPON PRINTING CO LTD

AI summary

A packaging material used for a bag for transporting of a silicon material is a laminate in which a first resin base layer, a barrier layer, a second resin base layer, a resin layer, and a sealant layer are laminated in that order, wherein an indentation elastic modulus (MPa) of the resin layer is smaller than an indentation elastic modulus (MPa) of each of the first resin base layer and the second resin base layer by one or more orders of magnitude, an indentation elastic modulus (MPa) of the sealant layer is smaller than an indentation elastic modulus (MPa) of the first resin base layer and an indentation elastic modulus (MPa) of the second resin base layer by one or more orders of magnitude, and a difference between the indentation elastic modulus (MPa) of the first resin base layer and the indentation elastic modulus (MPa) of the second resin base layer is smaller than a difference between the indentation elastic modulus (MPa) of the second resin base layer and the indentation elastic modulus (MPa) of the resin layer.