Silicon-Based OLED Display Substrate with Fragmented OTP Shielding

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Solution Overview

Problem

Silicon-based OLEDs are susceptible to OTP failure due to energy radiation and UV irradiation during manufacturing, leading to display abnormalities and reduced product yield.

Innovation Solution

A display substrate design with a metal shielding portion arranged in a fragmented manner to overlap with electronic devices, shielding them from energy radiation and UV irradiation, maintaining the stability of the OTP programming state.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If OTP is applied to silicon-based OLEDs to compensate for pixel units, then display effect is improved, but OTP is easily affected by energy radiation and UV irradiation during manufacturing, resulting in OTP failure and reduced product yield

Engineering Contradiction:
Improvedisplay effectVSAvoidenergy radiation and UV irradiation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a metal shielding layer as an intermediary substance between the OTP and the harmful radiation sources (energy radiation and UV irradiation). This metal layer acts as a mediator that blocks the harmful factors from directly affecting the OTP, thereby protecting the OTP's programming state while allowing the OTP to continue functioning for display compensation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies the shielding layer to the OTP before the manufacturing processes that involve energy radiation and UV irradiation. By pre-establishing the protective shielding structure, the OTP is protected in advance from the harmful effects of radiation and irradiation that will occur during subsequent manufacturing steps.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If shielding protection is added to protect OTP from radiation and UV irradiation, then OTP stability is improved, but device structure complexity increases

Engineering Contradiction:
ImproveOTP programming state stabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the shielding layer into the existing manufacturing process and device structure, making it serve multiple purposes: protecting OTP from radiation, maintaining process compatibility, and being formed using the same metal layer deposition processes already used for other device components. This multi-functionality approach adds protection without proportionally increasing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If metal shielding portion is arranged in fragmented manner to shield electronic devices, then protection effectiveness is improved, but manufacturing process complexity increases

Engineering Contradiction:
Improveradiation shielding effectivenessVSAvoidmanufacturing process complexity
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent divides the shielding structure into fragmented metal shielding portions arranged in multiple layers, where each layer contains discrete shielding elements. This segmentation provides effective radiation blocking while allowing the shielding to be integrated into the existing multi-layer device structure. The fragmented design follows the natural layering of the device architecture, making it compatible with standard manufacturing processes.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The metal shielding effectively protects the OTP, ensuring the stability of the programmable state and improving product yield and display uniformity by reducing the impact of radiation and UV exposure.

Implementation Method 1

the metal shielding portion is arranged in a fragmented manner on a side of each of the layers in which the semiconductor layer, the gate, the source and the drain of the second transistor are respectively located away from the silicon-based base substrate, wherein an orthographic projection of the metal shielding portion on the silicon-based base substrate at least partially overlaps with an orthographic projection of the electronic device on the silicon-based base substrate

Methodology Applied
Scientific EffectUV irradiation blocking: Absorption (EM radiation)

Implementation Method 2

the OTP for the silicon-based OLEDs is easily affected by energy radiation in an ion sputtering coating process and UV irradiation in a curing process

Methodology Applied
Scientific EffectEnergy radiation shielding: Absorption (EM radiation)

Data Source

PatentUS20250248237A1Display substrate and display apparatus
Publication Date: 2025.07.31 KUNMING BOE DISPLAY TECH CO LTD
  • US20250248237A1 patent drawing
  • US20250248237A1 patent drawing
  • US20250248237A1 patent drawing

AI summary

A display substrate and a display apparatus are provided. The display substrate includes: a silicon-based base substrate including an active area and an edge area; a plurality of sub-pixels in the active area, where at least one sub-pixel includes a pixel driving circuit including a first transistor including a semiconductor layer, a gate, a source, and a drain; an electronic device in the edge area including a second transistor including a semiconductor layer, a gate, a source and a drain which are arranged in same layers as the semiconductor layer, the gate, the source and the drain of the first transistor, respectively; and a metal shielding portion in the edge area arranged in a fragmented manner on a side of each of the layers in which the semiconductor layer, the gate, the source and the drain of the second transistor are respectively located away from the silicon-based base substrate, and orthographic projections of the metal shielding portion and the electronic device on the silicon-based base substrate overlap at least partially.