Silicon Substrate Beam Formation in Liquid Discharge Heads
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Solution Overview
Problem
Existing methods for forming beams in liquid supply ports of liquid discharge heads, particularly on the front surface where energy generating elements are located, face challenges such as difficulty in beam formation and nozzle layer displacement into the liquid supply port.
Innovation Solution
A method involving the formation of first and second liquid supply ports in a silicon substrate with blind holes, where anisotropic etching from the front surface forms the second liquid supply port, utilizing the silicon between blind holes as a beam to enhance substrate strength without disrupting the energy generating elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a mask is formed on the back surface of the substrate and etching is performed from both surfaces, then a beam is formed in the liquid supply port to increase substrate strength, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The liquid supply port formation is divided into multiple steps: first forming a preliminary liquid supply port, then forming blind holes, and finally performing anisotropic etching to create the final beam structure. This segmentation allows each step to be optimized independently, reducing overall process complexity while maintaining substrate strength.
Solution Approach 2:
A preliminary liquid supply port is formed first, followed by blind holes, before the final anisotropic etching step. This preliminary action establishes the basic structure early, allowing subsequent steps to refine the beam formation without requiring complex simultaneous operations from multiple surfaces.
2Strength
If etching is performed from both surfaces of the substrate, then a beam is formed in the liquid supply port, but the manufacturing time increases
Solution Approach 1:
The preliminary liquid supply port and blind holes are formed first, establishing the basic structure. The final anisotropic etching step then completes the beam formation in a single operation, avoiding the need for complex simultaneous two-sided etching processes and reducing total manufacturing time.
Solution Approach 2:
Blind holes are formed as intermediary structures that guide the subsequent anisotropic etching process. These blind holes serve as mediators that define the final beam shape without requiring direct complex patterning from both surfaces, thereby reducing process time while maintaining beam integrity.
3Adaptability or versatility
If energy generating elements and nozzle layers are present on the front surface, then liquid discharge function is achieved, but beam formation on the front surface side becomes difficult
Solution Approach 1:
Instead of forming the beam directly on the front surface where energy generating elements and nozzle layers are present, the method forms blind holes and performs anisotropic etching that creates the beam structure from the back surface side. This inversion of the formation approach allows beam creation without interfering with the front surface components, maintaining both liquid discharge function and manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for easy beam formation on the front surface of the liquid discharge head, increasing substrate strength and preventing nozzle layer displacement, thus improving the manufacturing process and performance of liquid discharge heads.
Implementation Method 1
subjecting the silicon substrate in which the plurality of blind holes are formed to anisotropic etching from the first surface to form a second liquid supply port in the silicon substrate
Data Source
AI summary
A method for manufacturing a liquid discharge includes a process of forming a plurality of blind holes extending from a first surface of the silicon substrate toward a second surface which is a surface opposite to the first surface in the silicon substrate and a process of subjecting the silicon substrate in which the plurality of blind holes are formed to anisotropic etching from the first surface to form a liquid supply port in the silicon substrate, in which, in the process of forming the liquid supply port, the silicon in a region sandwiched by the plurality of blind holes when the silicon substrate is seen from the second surface side is left without being removed by the anisotropic etching to use the left silicon as a beam.