Silicon Cap With Through-Hole Window For Optical Semiconductor Packaging
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Solution Overview
Problem
The manufacturing process of semiconductor apparatuses is complicated and costly due to the technical difficulty of forming through-wiring or wiring in recesses, which is necessary for encapsulating semiconductor devices.
Innovation Solution
A cap with a recess defined by a through-hole in a silicon substrate, where a silicon dioxide film covers the upper surface and the upper end of the through-hole, forming a window part that transmits light of a predetermined wavelength, allowing the semiconductor device to be installed and bonded without the need for complex wiring in the cap, thus simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-wiring or wiring is formed in the recess to enable semiconductor device installation, then the semiconductor device can be encapsulated and connected, but the manufacturing process becomes complicated and costly
Solution Approach 1:
The patent extracts the wiring function from the cap structure and relocates it to the substrate. The through-wiring is formed in the substrate before the recess is created, eliminating the need for complex wiring operations within the recess itself. This separation of functions simplifies the overall manufacturing process while maintaining connection reliability.
Solution Approach 2:
The patent performs the wiring formation operation before creating the recess. By forming through-wirings in the flat substrate prior to recess etching, the complex task of wiring is completed when the substrate is still accessible and flat, making the process simpler and more reliable than attempting to wire after recess formation.
2Ease of manufacture
If a flat substrate is used for manufacturing, then the substrate is easy to process, but forming recesses and wiring in the recess increases manufacturing complexity
Solution Approach 1:
The patent performs wiring formation on the flat substrate before the recess is created. This preliminary action allows all wiring operations to be conducted on a flat, easily processed surface, avoiding the need to perform complex wiring operations within the constrained geometry of the recess.
Solution Approach 2:
Instead of the conventional approach of forming recesses first and then attempting to wire them, the patent inverts the sequence by forming all wiring operations on the flat substrate before creating the recess. This reversal of the process sequence eliminates the fundamental difficulty of wiring in recesses.
3Strength
If the cap is made of silicon substrate, then the cap provides good mechanical strength, but the cap blocks light transmission needed for optical semiconductor devices
Solution Approach 1:
The patent applies local quality by creating a through-hole in the silicon cap that allows light to pass through the region where the optical semiconductor device is located. The silicon material maintains its light-blocking properties in most areas while providing a localized light transmission path through the through-hole, thus maintaining both mechanical strength and optical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the manufacturing cost of semiconductor apparatuses by eliminating the need for complex wiring in the cap and enhances light transmission efficiency through the use of a window part, enabling easy optical signal exchange.
Implementation Method 1
The coating film that covers the upper end part of the through-hole is a window part that transmits light having a predetermined wavelength
Data Source
AI summary
A cap for installing a semiconductor device that can send or receive a light having a predetermined wavelength, the cap including a recess for installing the semiconductor device, the recess being defined by a through-hole penetrating an upper surface of a silicon substrate and a lower surface of the silicon substrate, the through-hole having an upper end part of the through-hole on a side of the upper surface of the silicon substrate and a lower end part of the through-hole on a side of the lower surface of the silicon substrate, and a coating film formed to cover the upper surface of the silicon substrate and the upper end part of the through-hole, wherein the coating film that covers the upper end part of the through-hole is a window part that transmits the light having a predetermined wavelength.