Silicon Capacitor DC-DC Converter Module Lamination
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Solution Overview
Problem
The increasing power density requirements for power-supply modules and DC-DC converters, driven by higher power consumption in controllers, are hindered by the need for larger volume capacitors, making it difficult to downscale and thin these components while maintaining capacity.
Innovation Solution
A power-supply module configuration featuring a silicon capacitor and a switching circuit with transistors, where the capacitor and switching elements are configured to have matching thicknesses, allowing for lamination and parallel stacking to achieve the required power density without increasing thickness, and incorporating a controller to generate gate signals for the switching elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If electrolytic capacitors or multilayered ceramic capacitors are used to satisfy the required power capacity, then the power capacity is sufficient, but the volume increases and the module cannot be downscaled or made thinner
Solution Approach 1:
The patent changes the material parameter of the capacitor from conventional electrolytic or ceramic materials to silicon-based material. This parameter change enables achieving the same power capacity with a significantly reduced volume, as silicon capacitors have higher energy density compared to traditional capacitor materials.
Solution Approach 2:
The patent employs a composite structure where a silicon layer is formed on a semiconductor substrate, creating a silicon capacitor. This composite material approach combines the advantages of silicon's high breakdown voltage and capacitance density with the substrate's mechanical support, achieving high power capacity in a compact form factor.
2Power
If electrolytic capacitors or multilayered ceramic capacitors are used to satisfy the required power capacity, then the power capacity is sufficient, but the thickness increases making it difficult to make the module thinner
Solution Approach 1:
The patent changes the material parameter of the capacitor from conventional electrolytic or ceramic materials to silicon-based material. This parameter change enables achieving the same power capacity with a significantly reduced thickness, as silicon capacitors have higher energy density compared to traditional capacitor materials.
Solution Approach 2:
The patent transitions from vertical stacking of thick capacitor layers to a planar integration approach where the silicon capacitor is formed within the semiconductor substrate plane. This dimensional reorganization allows the capacitor to be embedded in the substrate rather than adding to the overall module thickness.
3Power
If multiple power-supply modules are laminated to meet power demands, then the power capacity increases, but the surface alignment becomes difficult and heat unevenness increases
Solution Approach 1:
The patent changes the material parameter of the capacitor from conventional electrolytic or ceramic materials to silicon-based material. This parameter change enables achieving the same power capacity with a significantly reduced volume, as silicon capacitors have higher energy density compared to traditional capacitor materials.
Data Source
AI summary
A power-supply module according to the present embodiment comprises a capacitor and a switching circuit. The switching circuit comprises a plurality of switching elements, and is configured to charge the capacitor by using an input voltage with a combination of connection and disconnection of the switching elements, and output an output voltage that is different from the input voltage. The capacitor is a silicon capacitor, and each of the switching elements is a transistor.