Silicon Carbide Preform Layering for Crack-Free Infiltration

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Solution Overview

Problem

Existing methods for producing reaction-bonded silicon carbide or boron carbide shaped bodies are limited by their inability to achieve complex geometries and large, unified components without cracking, due to shrinkage issues during drying and infiltration processes.

Innovation Solution

A method involving the layer-by-layer construction of a preform using shapeless grains with a binder, followed by impregnation with a soot suspension and subsequent reaction firing with silicon, allowing for the creation of porous structures that maintain dimensions and prevent cracking, enabling the production of complex geometries and undercuts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If casting processes (slip casting or ceramic bonding) are used to produce ceramic components, then packing density of ceramic powders is improved, but shrinkage during drying leads to cracks and limits geometric freedom

Engineering Contradiction:
Improvepacking densityVSAvoiddimensional stability
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent changes the grain size parameter to a specific range (70-200 μm) that optimizes both packing density and porosity. This parameter change allows the preform to maintain structural integrity during drying while preserving sufficient pore space for subsequent carbon impregnation and silicon infiltration, thereby avoiding cracks while achieving high packing density.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes a porous preform structure with controlled porosity that allows for subsequent impregnation with carbon and silicon. The porous structure prevents cracking during drying by reducing capillary forces, while maintaining high enough packing density to ensure adequate carbon and silicon uptake during infiltration processes.

Inventive Principle:
Principle #31Porous materials

2Shape

If complex geometries and undercuts are required, then assembly of multiple parts is necessary, but this increases device complexity and reduces reliability due to joints

Engineering Contradiction:
Improvegeometric freedomVSAvoidassembly complexity
Core Design Contradiction:
ShapeVSDevice complexity

Solution Approach 1:

The patent segments the manufacturing process into distinct stages (preform construction, carbon impregnation, silicon infiltration, reaction bonding) while producing a monolithic final component. This process segmentation enables geometric freedom without requiring physical assembly of multiple parts, thereby reducing device complexity and eliminating joint-related reliability issues.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses specific grain size parameters (70-200 μm) that enable the production of complex geometries with undercuts in a single monolithic component. The controlled porosity and pore size distribution allow the preform to be built with complex shapes while maintaining structural integrity throughout the subsequent infiltration and reaction bonding processes.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If larger grain sizes (70-200 μm) are used for preform construction, then porosity and packing density are optimized, but infiltration with carbon and silicon becomes more challenging

Engineering Contradiction:
Improveporosity and packing densityVSAvoidinfiltration processability
Core Design Contradiction:
Quantity of substanceVSEase of manufacture

Solution Approach 1:

The patent applies local quality by creating a pore size distribution that is optimized for both packing density and infiltration. The pore spaces between 70-200 μm grains are sized and distributed to facilitate adequate carbon and silicon infiltration while maintaining high packing density. This local optimization of pore characteristics resolves the contradiction between grain size and infiltration processability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes a specifically designed porous preform structure where the pore space is sufficient to allow complete infiltration with carbon and silicon. The porosity is optimized to balance packing density with infiltration accessibility, ensuring that larger grains (70-200 μm) do not prevent adequate material uptake during the reaction bonding process.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the production of monolithic, complex-shaped bodies with improved durability and freedom of geometry, avoiding the need for assembly and reducing manufacturing time, while maintaining the microstructure and stability of the final product.

Implementation Method 1

a preform is built up layer by layer from a formless grain using physical and/or chemical hardening or melting processes

Methodology Applied
Scientific EffectPhysical hardening:

Implementation Method 2

a preform is built up layer by layer from a formless grain using physical and/or chemical hardening or melting processes

Methodology Applied
Scientific EffectChemical hardening:

Implementation Method 3

The preform is impregnated at least once with a soot suspension or carbon is introduced via vapor deposition

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 4

In contact with liquid or gaseous silicon, a reaction firing then occurs, forming secondary silicon carbide

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 5

subsequent infiltration with liquid silicon to close the pores formed during the reaction of the silicon with the carbon

Methodology Applied
Scientific EffectInfiltration: Permeation

Data Source

PatentEP3057923B1Method for the production of molded bodies from reaction-bonded, silicon-infiltrated silicon carbide or boron carbide
Publication Date: 2024.05.15 SCHUNK INGENIEURKERAMIK GMBH
  • EP3057923B1 patent drawingFigure 1~2
  • EP3057923B1 patent drawingFigure 3a~3f

AI summary

The invention relates to a method for the production of molded bodies from reaction-bonded, silicon-infiltrated silicon carbide and/or boron carbide, wherein a preform body is monolithically constructed in layers from an amorphous granulation using a physical or chemical curing or melting process, wherein the granulation comprises a proportion of at least 95 % of silicon carbide and/or boron carbide with an average grain size of 70 to 200 μm. The thus formed preform body is impregnated at least once with a soot suspension or carbon is introduced by gas phase deposition and, when brought into contact with liquid or gaseous silicon, it forms at a subsequent calcining secondary silicon carbide which solidifies a resulting infiltrated composite.