Silicon Carrier Optoelectronic Packaging with Optical Vias
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Solution Overview
Problem
Current optical transceivers used in computers and integrated circuits are bulky and expensive, limiting their performance and cost-effectiveness, especially as communication distances and frequencies increase.
Innovation Solution
An optoelectronic assembly and packaging system that includes a silicon layer with optical vias and microlenses for light focusing, coupled with OE elements like VCSELs and photodiodes, and a carrier for interconnecting and thermal management, enabling compact and cost-effective integration of optical transceivers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If current optical transceivers are used for high-speed communication over long distances, then communication performance is improved, but device size and cost increase
Solution Approach 1:
The patent merges multiple optical components (VCSELs, photodiodes, microlenses, wiring layers) onto a single silicon carrier substrate, creating an integrated optoelectronic assembly that achieves compact size while maintaining high-speed communication capabilities through vertical cavity surface emitting lasers and photodetector arrays
Solution Approach 2:
The patent utilizes three-dimensional vertical stacking of optical components on the silicon carrier, with wiring layers positioned at different heights and optical vias penetrating through the substrate, enabling compact integration in the vertical dimension rather than spreading components horizontally
2Speed
If current optical transceivers are used for high-speed communication over long distances, then communication performance is improved, but device cost increases
Solution Approach 1:
The silicon carrier substrate serves multiple functions simultaneously: it acts as the mechanical support structure, provides electrical interconnections through integrated wiring layers, enables optical transmission through transparent regions and vias, and facilitates thermal management, thereby reducing the need for separate components and lowering overall system cost
Solution Approach 2:
The patent changes the material parameter by using silicon, a standard semiconductor material, as the carrier substrate instead of traditional optical mounting substrates, leveraging existing semiconductor manufacturing processes to reduce production costs while enabling integration of both electrical and optical functions
3Ease of manufacture
If electrical data links are used for short distances, then cost is reduced, but performance limit is reached as distance and frequency increase
Solution Approach 1:
The patent introduces optical communication as an intermediary solution that bridges the gap between electrical data links and fiber optic systems, using integrated VCSELs and photodiodes on the silicon carrier to provide high-speed communication capability that exceeds electrical link limits while maintaining cost-effectiveness through silicon-based integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the size and cost of optical transceivers while maintaining high-speed communication capabilities over long distances, improving system performance and efficiency.
Implementation Method 1
The optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via
Implementation Method 2
The assembly may further include VCSELs (vertical cavity surface emitting lasers) and photodiodes as OE elements
Implementation Method 3
The assembly may further include VCSELs (vertical cavity surface emitting lasers) and photodiodes as OE elements
Implementation Method 4
a carrier and thermal sink interposer may be positioned over the OE elements and in thermal contact with the OE elements
Data Source
AI summary
An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.