Silicon Circuit Board Substrate Adhered to Display Assembly
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Solution Overview
Problem
Conventional electronic devices face challenges in reducing thickness while maintaining durability and functionality, as they are prone to physical stress and environmental conditions, and traditional printed circuit boards (PCBs) are large, thick, and susceptible to failure.
Innovation Solution
The use of thin silicon circuit board substrates adhered to a display assembly for structural support, with direct bonding of contact pads for electrical connections, and optional reinforcement with molded members or castellated edge contacts for modular designs, eliminating the need for flex cables and wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional printed circuit boards (PCBs) are used, then electrical connections and structural support are provided, but the device thickness increases and durability decreases
Solution Approach 1:
The patent changes the fundamental material parameter from conventional PCB materials to silicon substrate, which has superior mechanical strength and thermal stability. This material parameter change enables thinner device construction while improving durability against physical stress and environmental conditions.
Solution Approach 2:
The patent employs composite material structures by bonding silicon substrates to display assemblies and incorporating molded reinforcing members. This composite approach combines the high strength-to-weight ratio of silicon with the structural support of molded members, achieving both thinness and durability.
2Length of stationary object
If thin silicon substrates are used, then device thickness decreases and manufacturing cost reduces, but structural strength and reliability deteriorate
Solution Approach 1:
The patent introduces molded reinforcing members as intermediary elements between the thin silicon substrate and the display assembly. These reinforcing members act as mediators that provide the necessary structural strength while allowing the silicon substrate to remain thin, thus resolving the contradiction between thickness and strength.
Solution Approach 2:
The patent creates a composite structure where thin silicon substrates are bonded to display assemblies and reinforced with molded members. This composite material approach allows the device to achieve both thinness and structural strength by combining materials with complementary properties.
3Ease of manufacture
If traditional PCB designs are used, then manufacturing processes are well-established, but manufacturing yield decreases and cost increases
Solution Approach 1:
The patent replaces the mechanical assembly processes of traditional PCB manufacturing with semiconductor fabrication techniques. By using silicon substrates that can be manufactured using established semiconductor industry processes, the patent achieves higher manufacturing yield and reduced costs while maintaining ease of manufacture through process integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a compact form factor with enhanced robustness against thermal cycling and vibrations, improved manufacturing yields, and reduced manufacturing costs, while allowing for easy component replacement in modular designs.
Implementation Method 1
an adhesive layer may be provided between the substrate and the display assembly
Implementation Method 2
contact pads on the substrate may be in direct contact with corresponding contact pads on the display assembly
Data Source
AI summary
A silicon circuit board substrate is utilized in an electronic device in place of conventional PCB motherboard. The silicon circuit board substrate is adhered to the back side of a display assembly to provide structural support for the substrate. The silicon circuit board substrate and the display assembly may be electrically connected via contact pads provided on the respective sides of the substrate and the display assembly that are connected together.