All-Silicon Coherent Receiver on CMOS Chip
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Solution Overview
Problem
Current coherent optical receivers face challenges in integrating tunable local oscillators and high-speed photodetectors within CMOS technology, requiring external III-V or Ge-based components and relying on off-chip lasers due to manufacturing difficulties, which limits their compactness, cost-effectiveness, and efficiency.
Innovation Solution
The integration of all-silicon waveguide photodetectors, tunable local oscillators, and semiconductor operational amplifiers within CMOS technology, along with embedded temperature sensors for wavelength control and programmable phase shifters for post-process corrections, enables the development of compact, cost-effective coherent optical receivers without the need for external wavelength lockers or thermoelectric coolers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external III-V or Ge-based components are used for tunable local oscillators and high-speed photodetectors, then performance requirements are met, but device compactness and manufacturing complexity are worsened
Solution Approach 1:
The patent merges previously separate external components (III-V or Ge-based tunable local oscillators and high-speed photodetectors) with the silicon photonic chip by integrating them directly onto the same substrate using compatible manufacturing processes. This consolidation eliminates the need for external components and complex interconnections, achieving both performance requirements and device compactness simultaneously
2Ease of manufacture
If off-chip lasers are used for wavelength control, then manufacturing is simplified, but device compactness and power efficiency are worsened
Solution Approach 1:
The patent integrates the laser source directly onto the silicon photonic chip as an on-chip component, combining the wavelength control function with the photodetector and optical hybrid in a single compact device. This eliminates the need for separate off-chip lasers and their associated coupling mechanisms, achieving both ease of manufacture and device compactness
3Adaptability or versatility
If embedded temperature sensors and programmable phase shifters are added for wavelength control, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent incorporates embedded temperature sensors and programmable phase shifters during the initial chip fabrication process, allowing wavelength control and phase adjustment capabilities to be built-in from the start. This preliminary integration enables adaptive wavelength control across temperature variations without requiring post-processing or external control mechanisms, improving adaptability while managing complexity through unified process integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the creation of high-performance, compact coherent optical receivers with improved power efficiency and reduced manufacturing complexity, capable of maintaining accurate wavelength control across a wide temperature range and achieving high data rates without the use of III-V or Ge-based materials.
Implementation Method 1
an optical amplifier to receive an optical signal and to generate an amplified signal based on the received optical signal
Implementation Method 2
a photodetector (PD) optically coupled with the optical hybrid to detect data on the tuned optical signal
Implementation Method 3
a thermal element proximate to the applied material to provide thermal energy to the applied material to tune an optical phase of light traveling within the waveguide
Implementation Method 4
a material applied to a surface of the first level of the first side and to a surface of the second level of the first side; and a thermal element proximate to the applied material to provide thermal energy to the applied material
Data Source
AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques related to coherent optical receivers, including coherent receivers with integrated all-silicon waveguide photodetectors and tunable local oscillators implemented within CMOS technology. Embodiments are also directed to tunable silicon hybrid lasers with integrated temperature sensors to control wavelength. Embodiments are also directed to post-process phase correction of optical hybrid and nested I/Q modulators. Embodiments are also directed to demultiplexing photodetectors based on multiple microrings. In embodiments, all components may be implements on a silicon substrate. Other embodiments may be described and/or claimed.