Silicon Cooling Package for Laser Gain Medium
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Solution Overview
Problem
Conventional metal-based cooling packages for laser systems suffer from corrosion, clogging, and deformation at high temperatures, making them unsuitable for compact laser systems with small form factor gain media.
Innovation Solution
A silicon-based thermal energy transfer apparatus with internal coolant flow channels and a silicon-based cover element, optionally coated with synthetic diamond or nanotubes, is used to efficiently remove thermal energy from disk-shaped, rectangular cuboid-shaped, or right circular cylinder-shaped gain medium crystals, incorporating non-corrosive materials for the coolant tubing and adapters to prevent fouling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional metal-based cooling packages are used, then thermal energy can be removed from the gain medium, but corrosion and clogging of coolant channels occur
Solution Approach 1:
The patent employs silicon as a composite material that combines high thermal conductivity for effective heat removal with inherent corrosion resistance. The silicon-based cooling package integrates multiple functions: it serves as both the cooling structure and a corrosion-resistant barrier, eliminating the need for separate protective coatings or linings that would be required with conventional metal materials.
2Temperature
If conventional metal-based cooling packages are used, then thermal energy can be removed from the gain medium, but deformation occurs at very high temperatures
Solution Approach 1:
The patent selects silicon as the material because its physical and chemical properties remain stable at the operating temperatures of laser gain media. Silicon maintains its structural integrity and dimensional stability at high temperatures, preventing the deformation issues that plague conventional metal-based cooling packages when exposed to extreme thermal environments.
3Volume of moving object
If small form factor gain media are used in compact laser systems, then the laser system size is reduced, but conventional metal cooling packages become unsuitable
Solution Approach 1:
The silicon-based cooling package is designed with integrated coolant channels directly formed within the silicon structure itself, rather than as separate components. This segmentation approach allows the cooling function to be embedded within the compact housing, making it suitable for small form factor gain media while maintaining reliability through the use of corrosion-resistant silicon material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicon-based solution effectively manages thermal energy transfer, preventing corrosion and deformation, thereby extending the lifespan of the gain medium and maintaining the laser system within normal operating parameters.
Implementation Method 1
The silicon-based manifold has internal coolant flow channels... that removes thermal energy from a disk-shaped gain medium crystal
Implementation Method 2
The second side of the manifold is substantially flat to provide surface area to contact with a first primary surface of the crystal
Data Source
AI summary
Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.