Silicon Core Wire Etching Device with Position Change Mechanism

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Solution Overview

Problem

Conventional etching techniques face challenges in evenly etching the entire surface of silicon core wires and preventing them from falling off the hanger due to the open structure, which requires increasing the number of hangers, leading to uneven etching and stability issues.

Innovation Solution

A silicon core wire etching device with a position change mechanism that allows the silicon core wire to pass through multiple core wire support members with holes, enabling even etching by changing the relative position of the wire within these holes, thereby ensuring stable support and uniform exposure to etching solutions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of hangers is increased to prevent silicon core wire from falling, then the stability of silicon core wire support is improved, but the evenness of etching deteriorates due to increased contact points

Engineering Contradiction:

Improvestability of silicon core wire supportVSAvoidevenness of etching

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The support structure is segmented into multiple core wire support members (first, second, third support members) with holes distributed along the silicon core wire. This segmentation allows the wire to be supported at multiple discrete points without requiring excessive hangers, thereby maintaining stability while minimizing contact points that would interfere with etching uniformity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The core wire support members act as intermediaries between the suspension system and the silicon core wire. These support members with holes provide stable support while allowing the etching solution to access the wire surface uniformly, mediating between the need for stability and the need for even etching.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If conventional L-shaped hangers are used to support silicon core wire, then the simplicity of support structure is maintained, but the risk of wire falling increases due to open space above the wire

Engineering Contradiction:

Improvesimplicity of support structureVSAvoidprevention of wire falling

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

Instead of using a single L-shaped hanger, the support structure is segmented into multiple core wire support members positioned at different locations along the silicon core wire. This segmentation provides distributed support points that prevent the wire from falling while maintaining structural simplicity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support members extend in multiple dimensions with holes that allow the wire to pass through. This dimensional arrangement creates a more secure support system compared to the conventional L-shaped hanger, preventing wire falling while keeping the structure simple.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If multiple hangers are used to support silicon core wire, then the stability of wire support is improved, but the device complexity increases due to more contact points

Engineering Contradiction:

Improvestability of wire supportVSAvoidnumber of contact points

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple support functions are merged into integrated core wire support members that combine support and positioning functions. This merging reduces the overall number of separate components and contact points compared to using multiple conventional hangers, thereby reducing device complexity while maintaining stability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The core wire support members serve multiple functions: supporting the wire, positioning it through holes, and allowing etching solution access. This multi-functionality reduces the need for separate components, decreasing device complexity while maintaining reliable support.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11998955B2Etching device for silicon core wire and etching method for silicon core wire

Publication Date: 2024.06.04 TOKUYAMA CORP

AI summary

A device is provided which is capable of evenly etching the entire surface of a silicon core wire. An etching device (1) for a silicon core wire (C1, C2, C3) includes: an etching bath (11, 12) for holding an etching solution (L1, L2); and a plurality of core wire support members (31) for supporting the silicon core wire (C1, C2, C3), the plurality of core wire support members (31) each having a hole (31A) through which the silicon core wire (C1, C2, C3) is to pass; and a position change mechanism (40) for changing a relative position where the silicon core wire (C1, C2, C3) passes through in relation to the hole (31A).