Silicon Curable Composition for Heat Resistance and Low Outgassing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing silicon-containing curable compositions for electronic materials lack simultaneous excellence in heat resistance, adherence, colorability, and transparency, and are limited by outgassing issues and insufficient performance in modern electronic applications.
Innovation Solution
A silicon-containing curable composition comprising a prepolymer with multiple Si—H groups obtained from cyclic siloxane compounds through hydrosilylation reactions, combined with a cyclic siloxane compound and a polysiloxane compound, along with a hydrosilylation catalyst, which also includes optional fillers and a compound with an isocyanuric acid structure to enhance properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If silicone resins are used for heat resistance and flexibility, then heat resistance and flexibility are improved, but outgassing components increase causing contamination problems
Solution Approach 1:
The patent changes the chemical composition parameters by using specific cyclic siloxane compounds with controlled molecular structures and ratios, eliminating outgassing components while maintaining heat resistance through precise compositional control
Solution Approach 2:
The patent creates a composite curable composition combining multiple components (cyclic siloxane compound, prepolymer, crosslinking agent, catalyst) that work synergistically to achieve heat resistance without outgassing issues
2Reliability
If conventional silicon-containing curable compositions are used, then basic material properties are achieved, but simultaneous excellence in heat resistance, adherence, colorability, and transparency cannot be achieved
Solution Approach 1:
The patent designs a multi-functional curable composition where the cyclic siloxane compound and associated components simultaneously provide heat resistance, adherence, colorability, transparency, and crack resistance through their chemical structures and interactions
3Temperature
If materials with high heat resistance are used for electronic applications, then thermal stability is improved, but transparency and adherence may be compromised
Solution Approach 1:
The patent optimizes local molecular structures and compositional ratios to achieve high heat resistance in specific regions while maintaining overall transparency and adherence through controlled distribution of functional components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent heat resistance, adherence, and transparency, suitable for insulating films, adhesives, and other electronic materials, with improved handling and mechanical properties.
Implementation Method 1
a prepolymer (A) containing two or more Si—H groups in one molecule, which is obtainable by subjecting one or more kinds of a cyclic siloxane compound (α) represented by the following formula (1) and one or more kinds of a compound (β) represented by the following formula (2), to a hydrosilylation reaction
Implementation Method 2
a hydrosilylation catalyst (D)
Data Source
AI summary
Provided is a silicon-containing curable composition which includes a prepolymer (A) containing two or more Si—H groups in one molecule, which is obtained by subjecting one or more kinds of a cyclic siloxane compound (α) represented the following formula (1) and one or more kinds of a compound (β) represented by the following formula (2), to a hydrosilylation reaction; a cyclic siloxane compound (B) containing, in one molecule, two or more carbon-carbon double bonds that are reactive with Si—H groups; a polysiloxane compound (C) which is different from the prepolymer (A) and the cyclic siloxane compound (B); and a hydrosilylation catalyst (D). In formula (1), R1 to R3 each represent an alkyl group having 1 to 6 carbon atoms, or a phenyl group; a represents a number from 2 to 10; and b represents a number from 0 to 8. In formula (2), n represents the number 1 or 2.