Silicon-Based Display Assembly with Separate Logic Control Board
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Solution Overview
Problem
The elongated design of the display driver chip in silicon-based OLED products limits the layout of high-speed data processing and image compression modules, leading to design and manufacturing difficulties and increased costs.
Innovation Solution
The silicon-based display assembly separates the display driver chip into a source signal driver circuit and a logic control board, allowing for a square layout and independent manufacturing processes, with the logic control board performing high-speed data processing and image compression functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the DDIC is designed in an elongated shape to accommodate signal lines and power lines connections, then the electrical connection reliability is improved, but the layout flexibility for high-speed functional regions deteriorates
Solution Approach 1:
The patent segments the DDIC into two independent parts: a monocrystalline silicon chip for the active addressing matrix and a separate drive control circuit portion for high-speed data processing. This segmentation allows each part to be optimized independently - the chip maintains its compact square shape while the driver circuit can be designed with optimal layout for signal processing functions, resolving the contradiction between connection reliability and layout flexibility.
Solution Approach 2:
The patent introduces a flexible circuit board as an intermediary component between the monocrystalline silicon chip and the drive control circuit portion. This intermediary allows electrical connections to be established without requiring the DDIC to be in an elongated shape, as the flexible circuit board can be configured to accommodate both the chip's compact form factor and the driver circuit's layout requirements, thus maintaining connection reliability while preserving layout flexibility.
2Adaptability or versatility
If the drive control circuit portion is integrated with the active addressing matrix on the same chip, then the device integration level is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent divides the display device into separate functional modules: the monocrystalline silicon chip containing the active addressing matrix and the drive control circuit portion. This segmentation enables different manufacturing processes to be applied to each module according to their specific requirements - the chip can be manufactured using mature CMOS processes while the driver circuit can use optimized processes for high-speed data processing, thereby reducing overall manufacturing complexity while maintaining high integration level.
Solution Approach 2:
The patent merges the separately manufactured monocrystalline silicon chip and drive control circuit portion through bonding to form the complete DDIC. This merging approach allows each component to be manufactured independently with optimal processes, then combined to achieve high integration, thus resolving the contradiction between integration level and manufacturing complexity.
3Measurement precision
If the pixel size is reduced to one-tenth of conventional display devices for higher precision, then the display resolution is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs a monocrystalline silicon chip with an active addressing matrix that enables self-addressing and self-driving of pixels. This self-service capability allows the highly precise pixel array to be controlled with reduced external intervention, compensating for the increased manufacturing precision requirements through intelligent control mechanisms that can tolerate and correct for minor fabrication variations.
Solution Approach 2:
The patent transitions from amorphous or microcrystalline silicon to monocrystalline silicon, fundamentally changing the material parameter to achieve higher precision. Monocrystalline silicon provides superior electrical properties and uniformity, enabling the fabrication of smaller, more precise pixels while maintaining manufacturing feasibility through the material's inherent stability and controllability.
Data Source
AI summary
Provided are a silicon-based display assembly and a display device. The silicon-based display assembly is provided with a silicon-based panel, a flexible circuit board, and a logic control board. An end of the flexible circuit board is bonded to a first bonding region of the silicon-based panel. The logic control board is disposed on the flexible circuit board. The logic control board is integrated with a timing controller module, an algorithm processing module, a first input interface module, a first output interface module, and a power module. The logic control board is configured to at least perform high-speed data receiving and high-speed data processing.