Silicon-Substrate Display Structure Without Bonding Assembly
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Solution Overview
Problem
Current display device manufacturing processes are costly and complex, particularly due to the need for bonding processes to combine light-emitting elements and circuit layers.
Innovation Solution
A display device structure and manufacturing method that utilizes both surfaces of a silicon substrate to form light-emitting elements and circuit layers, electrically connecting them through openings in the substrate, thereby omitting the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding processes are used to combine light-emitting elements and circuit layers, then reliable electrical connection is achieved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent merges the light-emitting element and circuit layer onto a single silicon substrate, eliminating the need for separate bonding processes. The circuit layer is formed directly on the silicon substrate using standard semiconductor fabrication techniques, while the light-emitting element is integrated through the substrate thickness, achieving both functional integration and simplified manufacturing.
Solution Approach 2:
The patent utilizes the third dimension (depth) of the silicon substrate to resolve the contradiction. The light-emitting element is positioned at a different depth level than the circuit layer, with electrical connection achieved through vertical openings (through-holes) in the substrate. This dimensional separation allows independent formation of each component while maintaining reliable electrical connection without complex bonding.
2Reliability
If bonding processes are used to combine light-emitting elements and circuit layers, then reliable electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges the light-emitting element and circuit layer onto a single silicon substrate, eliminating the need for separate bonding processes. The circuit layer is formed directly on the silicon substrate using standard semiconductor fabrication techniques, while the light-emitting element is integrated through the substrate thickness, achieving both functional integration and simplified manufacturing.
Solution Approach 2:
The silicon substrate serves multiple functions simultaneously: it acts as the structural base for the circuit layer, provides the medium for light-emitting element integration, and serves as the electrical connection pathway through its thickness. This self-service approach eliminates the need for additional bonding materials and processes, reducing manufacturing cost while maintaining reliability.
3Device complexity
If both surfaces of silicon substrate are utilized to form light-emitting elements and circuit layers, then bonding process is omitted, but electrical connection through substrate must be ensured
Solution Approach 1:
The patent utilizes the third dimension (depth) of the silicon substrate to resolve the contradiction. The light-emitting element is positioned at a different depth level than the circuit layer, with electrical connection achieved through vertical openings (through-holes) in the substrate. This dimensional separation allows independent formation of each component while maintaining reliable electrical connection without complex bonding.
Solution Approach 2:
The patent applies local quality by creating specific regions in the silicon substrate with different properties. The bulk substrate maintains its original electrical characteristics, while localized openings are formed to provide electrical pathways. The circuit layer and light-emitting element interfaces are locally optimized to ensure precise electrical connection without affecting the overall substrate integrity.
Data Source
AI summary
A display device includes a first base layer, a circuit layer above the first base layer, a silicon substrate above the circuit layer, a light-emitting element above the silicon substrate, and electrically connected to the circuit layer through an opening defined by the silicon substrate, and a second base layer above the silicon substrate and the light-emitting element.