Silicon Single Crystal Dopant Supply Unit for Concentration Control
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Solution Overview
Problem
The existing CZ method for producing silicon single crystals faces challenges in precisely controlling the sublimation speed of dopants like arsenic and phosphorus, leading to variations in dopant concentration and resistance values, and an increased likelihood of crystal breakage during the pulling process, especially when high concentrations are used.
Innovation Solution
A dopant supply unit with a controlled heating mechanism that adjusts the sublimation speed of sublimable dopants, ensuring optimal introduction efficiency and concentration, and a blowing method that introduces dopants to the melt without submerging the tube, stabilizing the growth process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the dopant accommodation chamber is positioned higher above the melt to avoid interfering with the pulling mechanism, then the pulling process is smoother, but the sublimation speed of the dopant decreases and introduction efficiency is reduced
Solution Approach 1:
A carrier gas (inert gas such as argon) is introduced as an intermediary to transport the sublimed dopant from the accommodation chamber to the melt. The carrier gas flows through the supplying tube and carries the dopant vapor to the melt surface, enabling effective dopant introduction even when the accommodation chamber is positioned higher and does not directly contact the melt.
2Reliability
If the dopant concentration in the melt is increased to produce low-resistivity N++ type silicon single crystals, then the electrical property is improved, but the likelihood of crystal breakage during pulling increases
Solution Approach 1:
The dopant is sublimed and introduced to the melt in advance before the crystal pulling process begins. By pre-doping the melt with the required concentration of dopant, the crystal grows with uniform dopant distribution throughout the pulling process, avoiding local concentration variations that could cause stress and breakage during pulling.
3Device complexity
If radiant heat from the melt is used to sublime the dopant, then the process is simpler, but the sublimation speed varies and dopant concentration control becomes imprecise
Solution Approach 1:
The heating system is replaced from a mechanical/radiant heat approach to a controlled thermal field approach. Instead of relying on radiant heat from the melt, an independent heating system with controlled thermal fields is used to sublime the dopant at precise, controlled rates, enabling accurate control of dopant concentration in the melt.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise control of dopant concentration and resistance values, reducing crystal breakage and ensuring stable growth of low-resistivity N++ type silicon single crystals by optimizing sublimation speed and introduction methods.
Implementation Method 1
heating the dopant in the accommodation chamber by radiant heat radiated from the melt to evaporate
Implementation Method 2
introducing, from the accommodation chamber to the melt, the dopant that has becomes the gas as a result of the evaporation
Data Source
AI summary
The sublimation speed of dopant can be precisely controlled without being influenced by a change over time of intra-furnace thermal environment. A dopant supply unit equipped with an accommodation chamber and a supply tube is provided. A sublimable dopant is accommodated. Upon sublimation of the dopant within the accommodation chamber, the sublimed dopant is introduced into a melt. The dopant within the accommodation chamber of the dopant supply unit is heated. The amount of heating by means of heating means is controlled so as to sublime the dopant at a desired sublimation speed. The dopant is supplied to the melt so that the dopant concentration until the first half of a straight body portion of the silicon single crystal is in the state of low concentration or non-addition. After the first half of the straight body portion of the silicon single crystal is formed, the dopant is supplied to the melt so that every portion of the crystal is in the state where the dopant is added to a desired high concentration.


