Silicon-Containing Epoxy Resin for Metal Adhesion and Low Dielectric Loss

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Solution Overview

Problem

Epoxy resin compositions that combine with other components to improve dielectric characteristics struggle to achieve sufficient adhesion strength to metals like copper and aluminum, which is crucial for applications in semiconductor sealing and printed circuit boards.

Innovation Solution

An epoxy resin composition comprising a specific epoxy resin with a silicon atom and an alicyclic epoxy group, an acid anhydride-based curing agent, and a tertiary amine or imidazole curing accelerator is developed to enhance adhesion strength while maintaining low dielectric constant and loss tangent.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If epoxy resin is combined with phenol novolak resin to improve dielectric characteristics, then dielectric constant and dielectric loss tangent are reduced, but adhesion strength to metal is insufficient

Engineering Contradiction:

Improvedielectric loss tangentVSAvoidadhesion strength to metal

Core Design Contradiction:

Loss of energyVSStrength

Solution Approach 1:

The invention changes the chemical composition parameters by introducing a specific silicon-containing epoxy resin with alicyclic epoxy groups, replacing part of the conventional epoxy resin. This parameter change achieves both low dielectric loss tangent and high adhesion strength to metal simultaneously

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite resin system combining silicon-containing epoxy resin, conventional epoxy resin, and phenol novolak resin in specific ratios. This composite approach leverages the low dielectric properties of phenol novolak resin while the silicon-containing epoxy resin provides strong metal adhesion, resolving the contradiction between dielectric performance and adhesion strength

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If copper foil surface roughness is reduced for low-roughness copper wiring, then transmission signal quality improves, but anchor effect and adhesion strength are reduced

Engineering Contradiction:

Improvecopper foil surface roughnessVSAvoidadhesion strength to copper wiring

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The invention changes the chemical composition of the epoxy resin system by incorporating silicon-containing epoxy resin with specific molecular structure. This chemical parameter change enables the resin to form strong chemical bonds with smooth copper surfaces, compensating for the reduced mechanical anchor effect

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention replaces reliance on mechanical interlocking (anchor effect from rough surfaces) with chemical bonding mechanisms. The silicon-containing epoxy resin forms strong chemical adhesion to copper surfaces, substituting the mechanical anchor effect that would normally be provided by surface roughness

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves high adhesion strength to metals and maintains excellent dielectric characteristics, making it suitable for semiconductor sealing, printed circuit boards, and other composite materials.

Implementation Method 1

Epoxy resins, which are a type of thermosetting resin... cured products thereof have excellent heat resistance

Methodology Applied

Scientific EffectCuring reaction: Chemical Bonding

Implementation Method 2

having high adhesion strength to metal

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentEP3321302B1Epoxy resin composition, process for producing same, and uses of said composition

Publication Date: 2021.06.30 SUMITOMO SEIKA CHEM CO LTD

AI summary

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc., and n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.