Silicon Optical Fiber Clamp Sub-Micron Alignment
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Solution Overview
Problem
Current optical fiber clamps used in optical communications have high manufacturing costs and limited precision due to mechanical processing methods, leading to alignment errors and increased maintenance costs.
Innovation Solution
A silicon-based optical fiber clamp with guide and locating holes formed using semiconductor fabrication processes, including photolithography and etching, to achieve submicron positioning accuracy and reduce production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical processing methods (molding, grinding, drilling) are used to fabricate optical fiber clamps, then the manufacturing process is simple and equipment requirements are low, but the positioning accuracy is limited to tens to hundreds of microns and production cost is high
Solution Approach 1:
The patent replaces traditional mechanical processing methods (molding, grinding, drilling) with semiconductor fabrication processes (photolithography, plasma etching). This substitution enables positioning accuracy at the sub-micron level while maintaining ease of manufacture through standardized semiconductor manufacturing equipment and processes.
Solution Approach 2:
The patent changes the fundamental processing parameters from mechanical domain (tool diameters, feed rates, spindle speeds) to semiconductor domain (photoresist thickness, etch selectivity, pattern dimensions). This parameter transformation allows achieving sub-micron positioning accuracy that is unattainable with conventional mechanical methods.
2Manufacturing precision
If additional equipment or high precision processing machines are employed to improve positioning accuracy, then the positioning accuracy increases, but the production cost increases significantly
Solution Approach 1:
The patent utilizes semiconductor fabrication equipment that serves multiple purposes: photolithography tools create precise patterns, plasma etching equipment forms accurate holes, and standard semiconductor process equipment achieves sub-micron positioning. This multi-functionality eliminates the need for specialized high-cost mechanical processing equipment while maintaining high positioning accuracy.
3Reliability
If conventional manufacturing methods are used, then the manufacturing process is established and simple, but the success rate of coupling at the first attempt is low and operation and maintenance costs are high
Solution Approach 1:
The patent replaces mechanical drilling and molding with photolithography and plasma etching, achieving positioning accuracy at the sub-micron level. This dramatically improves the coupling success rate by eliminating alignment errors between clamp components and ensuring precise positioning of optical fibers, thereby reducing rework and maintenance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicon-based optical fiber clamp achieves higher precision and lower manufacturing costs by utilizing mature semiconductor processes, enabling precise alignment and reducing the risk of damage during optical fiber coupling.
Implementation Method 1
forming a guide hole under a top surface of each clamp body, the guide hole having an upper diameter greater than a lower diameter of the guide hole and having an inclined sidewall
Implementation Method 2
forming a guide hole under a top surface of each clamp body
Implementation Method 3
forming one or more locating holes, each having a depth of 250 μm to 500 μm, by first etching the hard mask layer by using the negative photoresist as a mask and then etching the silicon wafer by using the hard mask layer as a mask
Implementation Method 4
etching the silicon wafer by using the hard mask layer as a mask
Data Source
AI summary
An optical fiber clamp and fabrication method thereof are disclosed. The optical fiber clamp includes one or more clamp units. Each clamp unit includes a clamp body formed of silicon, a guide hole formed under a top surface of the clamp body, the guide hole having an upper diameter greater than a lower diameter of the guide hole and having an inclined sidewall; and a locating hole connected to and extends downward from a bottom of the guide hole through the clamp body, the locating hole having an upper diameter equal to a lower diameter of the locating hole and smaller than the lower diameter of the guide hole.