Silicon Fiber Coupling Structure With Etched Reflective Sidewall
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Solution Overview
Problem
Existing technologies face challenges in improving the integration and efficiency of optical and electrical signal transmission and processing, particularly in devices combining long-range optical components with short-range electrical components, where improvements are desired for better conversion and processing.
Innovation Solution
The formation of reflective silicon surfaces with low roughness and high angle precision is used to redirect optical signals in fiber coupling structures, utilizing semiconductor processing techniques and anisotropic etching to create crystalline planes for improved optical coupling between optical fibers and photonic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional optical coupling methods are used, then device integration is achieved, but optical coupling efficiency is insufficient
Solution Approach 1:
The patent changes the physical parameters of the silicon surface by creating crystalline planes with specific orientations (e.g., <110> planes at 45 degrees) through anisotropic etching. This parameter change in surface geometry and crystal orientation enables efficient optical coupling without requiring complex alignment mechanisms, thus improving reliability while maintaining ease of manufacture.
Solution Approach 2:
The patent replaces mechanical alignment systems with optically active crystalline structures. Instead of relying on precise mechanical positioning of optical components, the invention uses the inherent optical properties of anisotropically etched silicon crystalline planes to achieve efficient coupling, thereby improving optical coupling efficiency without increasing integration complexity.
2Reliability
If optical fibers are directly coupled to photonic components, then signal transmission is achieved, but coupling reliability is insufficient
Solution Approach 1:
The patent modifies the optical interface parameters by creating specific crystalline plane orientations (e.g., 45-degree <110> planes) on the silicon substrate. These parameter changes in surface geometry enable more robust optical coupling that is less sensitive to alignment variations, thereby improving coupling reliability without requiring extremely high manufacturing precision.
Solution Approach 2:
The patent incorporates alignment tolerance compensation into the design of the crystalline structure itself. The anisotropically etched features provide built-in alignment guidance and tolerance for misalignment, cushioning against the effects of manufacturing variations before they can degrade coupling reliability.
3Manufacturing precision
If semiconductor processing techniques are used, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent merges the optical functionality with the existing silicon substrate structure by integrating crystalline plane formation directly into the semiconductor processing flow. The anisotropic etching step that creates precise crystalline planes is combined with standard silicon fabrication processes, achieving high manufacturing precision without significantly increasing overall device complexity.
Solution Approach 2:
The patent utilizes the inherent anisotropic etching properties of silicon crystal structures to self-form the desired optical interfaces. The crystalline planes automatically orient themselves at specific angles (e.g., 45 degrees) during etching, providing self-alignment and self-configuration that reduces the need for additional complex processing steps while maintaining high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances optical coupling efficiency and reliability, allowing for faster and more reliable transmission of optical signals between optical fibers and photonic components, improving system performance.
Implementation Method 1
utilizing semiconductor processing techniques and anisotropic etching to create crystalline planes
Implementation Method 2
reflective silicon surfaces... are formed to redirect optical signals as part of a fiber coupling structure
Data Source
AI summary
A structure includes an upper silicon structure that includes a recess in a first side of the upper silicon structure, wherein the recess has a sloped sidewall; a lower silicon structure that includes a lens recessed in a first side of the lower silicon structure, wherein the first side of the upper silicon structure is bonded to the first side of the lower silicon structure, wherein the sloped sidewall of the upper silicon structure is vertically aligned with the lens of the lower silicon structure; and a waveguide structure within the recess, wherein the waveguide structure is optically coupled to the lens by the sloped sidewall.