Silicon-Free Bonding Adhesive for High-Temperature C/C Composites
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Solution Overview
Problem
Existing methods for bonding carbon-carbon (C/C) parts in high-temperature applications using silicon (Si)-based or silicon carbide (SiC)-based resins result in low carbon yield, low graphitizability, and poor thermal conductivity, leading to mismatch issues.
Innovation Solution
A silicon-free bonding adhesive is used, comprising thermoset or thermoplastic resins like phenolic-based, polyimide-based, or polybenzoxazine-based resins, reinforced with carbon fibers or nanotubes, and enhanced by surface etching, carbon nanofiber or nanotube growth, and internal carbon dowels to create high contact surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon-based or silicon carbide-based resins are used for bonding carbon-carbon parts, then bonding capability is achieved, but carbon yield is low and graphitizability is poor
Solution Approach 1:
The patent changes the chemical composition parameters of the bonding adhesive by eliminating silicon and silicon carbide components, and instead using carbon fiber-reinforced phenolic resin or pitch-based adhesives. This parameter change resolves the contradiction by achieving bonding capability while maintaining high carbon yield and graphitizability compatible with carbon-carbon composite parts.
Solution Approach 2:
The patent employs composite adhesive materials consisting of phenolic resin or pitch combined with carbon fiber reinforcement. This composite structure provides both bonding functionality and carbon compatibility, resolving the contradiction between achieving bond strength and maintaining carbon yield through the synergistic properties of the composite formulation.
2Reliability
If silicon-based or silicon carbide-based resins are used for bonding carbon-carbon parts, then bonding is achieved, but thermal conductivity is poor causing mismatch issues
Solution Approach 1:
The patent changes the thermal properties of the bonding system by selecting adhesive materials (carbon fiber-reinforced phenolic resin or pitch-based adhesives) with thermal conductivity parameters matched to carbon-carbon composite parts. This resolves the thermal conductivity mismatch issue while maintaining bonding strength through optimized material selection and formulation.
3Strength
If surface etching or carbon nanofiber growth is performed to enhance bonding, then bonding strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies surface etching and carbon nanofiber growth as preliminary surface preparation steps before adhesive application. These preliminary actions modify the surface morphology and chemistry of the carbon-carbon parts to enhance adhesive bonding, resolving the contradiction by improving bonding strength through controlled surface treatment that, while adding steps, provides necessary interfacial compatibility for high-performance bonding.
Solution Approach 2:
The patent uses carbon fiber-reinforced adhesives that inherently provide enhanced bonding strength through the composite structure of the adhesive itself, reducing the need for complex surface treatment processes and thereby lowering manufacturing complexity while maintaining strong bonds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bonding strength and thermal properties, achieving high-temperature compatibility and improved carbon yield.
Implementation Method 1
applying a bonding adhesive to at least one of a first surface of a first composite preform component or a first surface of a second composite preform component; and joining the first surface of the first composite preform component to the first surface of the second composite preform component
Implementation Method 2
the bonding adhesive is silicon-free and includes at least one of a thermoset resin or a thermoplastic resin
Implementation Method 3
the thermoplastic resin is at least one of an isotropic pitch, mesophase pitch, polyetheretherketone (PEEK), or polyaryleetherketones (PAEK)
Implementation Method 4
the at least one of the first surface of the first composite preform component or the first surface of the second composite preform component are prepared by surface etching the at least one of the first surface of the first composite preform component and the first surface of the second composite preform component
Implementation Method 5
the at least one of the first surface of the first composite preform component or the first surface of the second composite preform component are prepared by growing carbon nanofibers or carbon nanotubes on the at least one of the first surface of the first composite preform component or the first surface of the second composite preform component
Data Source
AI summary
A manufacturing method is provided. The manufacturing method applies a bonding adhesive to at least one of the first surface of the first composite preform component or the first surface of the second composite preform component, and joins the first surface of the first composite preform component to the first surface of the second composite preform component.